发明授权
- 专利标题： Solder-bonded structure
- 专利标题（中）： 焊接结构
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申请号： US991314申请日： 1992-12-16
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公开(公告)号： US5361966A公开(公告)日： 1994-11-08
- 发明人: Masakata Kanbe , Hitoshi Iwata , Kenichi Kinoshita
- 申请人： Masakata Kanbe , Hitoshi Iwata , Kenichi Kinoshita
- 申请人地址： JPX Aishi
- 专利权人： Kabushiki Kaisha Tokai Rika Denki Seisakusho
- 当前专利权人： Kabushiki Kaisha Tokai Rika Denki Seisakusho
- 当前专利权人地址： JPX Aishi
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; H05K1/09 ; H05K3/34 ; H01L21/60
摘要：
An improved solder-bonding structure is disclosed that is particularly suitable for soldering the components of hybrid ICs. The solder-bonding structure includes a conductor formed on a substrate. The conductor is formed from silver and platinum. A solder layer formed from a tin and silver solder is then formed on the conductor to couple an electronic element to the conductor. In preferred aspects of the invention, the platinum content in the conductor is in the range of approximately 0.7 to 1.0% by weight. The silver content in the solder layer is in the range of approximately 0.1 to 5.0% by weight.
公开/授权文献
- US5987136A Image authentication patterning 公开/授权日：1999-11-16
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