An integrated thermoplastic resin/silicone rubber article is prepared by modifying a thermoplastic resin with a silicon-containing compound in monomer or polymer form, molding the thermoplastic resin into a shape, contacting an uncured silicone rubber with the molded thermoplastic resin, and curing the silicone rubber at a temperature below the softening point of the thermoplastic resin. The article in which the thermoplastic resin is firmly united with the silicone rubber is useful in electric, electronic and automotive applications while taking advantage of the inherent reliability in heat resistance, weather resistance and electrical properties of the silicone rubber.