发明授权
- 专利标题: Polishing machine and method of dissipating heat therefrom
- 专利标题(中): 抛光机及其散热方法
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申请号: US22478申请日: 1993-02-25
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公开(公告)号: US5400547A公开(公告)日: 1995-03-28
- 发明人: Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
- 申请人: Kohichi Tanaka , Hiromasa Hashimoto , Fumio Suzuki
- 申请人地址: JPX Tokyo
- 专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX4-078290 19920228
- 主分类号: B24B37/015
- IPC分类号: B24B37/015 ; B24B37/04 ; B24B37/12 ; B24B37/16 ; B24B49/14 ; B24B55/02 ; B24B7/22
摘要:
A polishing machine for polishing a flat workpiece such as a semiconductor wafer has a rotatable reference table supporting an abrasive cloth disposed on a surface thereof, and a rotatable workpiece holder for holding a flat workpiece against the abrasive cloth. While the flat workpiece is being polished by the abrasive cloth, an abrasive compound is supplied between the abrasive cloth and the flat workpiece. The reference table has grooves defined therein for dissipating heat from the reference table and the abrasive cloth while the flat workpiece is being polished by the abrasive cloth. The grooves may be supplied with either the abrasive compound or a coolant.
公开/授权文献
- US5957703A Interconnecting electrical connector 公开/授权日:1999-09-28