A substrate applicable to be used in a multichip module including a plurality of integrated circuits. The substrate includes a series of interrelated metal layers, ceramic layers and lattice structures formed by the ceramic layers. The metal layers provide ground planes, power planes and interconnects for the integrated circuit. The lattice structure consists of a series of ceramic regions separating the ceramic layers such that the majority of the lattice structure is air in order to reduce the effective dielectric constant of the substrate.