公开(公告)号：US5402003A

公开(公告)日：1995-03-28

申请号：US151327

申请日：1993-11-12

Applicant: George W. McIver ,  Paula R. Hurt ,  John E. Dowsing, III

Inventor： George W. McIver ,  Paula R. Hurt ,  John E. Dowsing, III

IPC: H01L23/13 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H01L27/10 ,  H01L27/15

CPC classification number: H05K1/024 ,  H01L23/13 ,  H01L23/5381 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0195 ,  H05K2201/0715

Abstract: A substrate applicable to be used in a multichip module including a plurality of integrated circuits. The substrate includes a series of interrelated metal layers, ceramic layers and lattice structures formed by the ceramic layers. The metal layers provide ground planes, power planes and interconnects for the integrated circuit. The lattice structure consists of a series of ceramic regions separating the ceramic layers such that the majority of the lattice structure is air in order to reduce the effective dielectric constant of the substrate.

Abstract translation: 一种可应用于包括多个集成电路的多芯片模块的基板。 衬底包括由陶瓷层形成的一系列相互关联的金属层，陶瓷层和晶格结构。 金属层为集成电路提供接地层，电源层和互连。 晶格结构由分离陶瓷层的一系列陶瓷区域组成，使得大部分晶格结构是空气，以便降低衬底的有效介电常数。

公开(公告)号：US6028007A

公开(公告)日：2000-02-22

申请号：US274832

申请日：1999-03-23

Applicant: Steven S. Chan ,  John E. Dowsing, III ,  Jason E. Snodgress

Inventor： Steven S. Chan ,  John E. Dowsing, III ,  Jason E. Snodgress

IPC: H01L23/12 ,  H01L23/66 ,  H01P1/08 ,  H01P11/00 ,  H01L21/311

CPC classification number: H01L23/66 ,  H01P1/08 ,  H01L2924/0002 ,  Y10T29/49016

Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.

Abstract translation: 本发明涉及一种用于生产低成本密封的集成模块装配（IMA）封装的方法，其中铝涂层（24）沉积在聚四氟乙基底（20）上，铝涂层（24）被选择性地蚀刻到 形成波导窗口（26），并且在波导窗口（26）上选择性地处理衬底（20）以产生非导电气密封。 然后将基板（20）接合到包含波导管（30）的金属载体（28）上。 作为使用选择性处理的低成本基底以产生气密密封的结果，不需要更昂贵的基底以在基底与波导互连之间形成气密密封。

公开(公告)号：US5541565A

公开(公告)日：1996-07-30

申请号：US445965

申请日：1995-05-22

Applicant: John E. Dowsing, III ,  Jeffrey M. Edwards ,  Duncan M. Smith

Inventor： John E. Dowsing, III ,  Jeffrey M. Edwards ,  Duncan M. Smith

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H01P5/02 ,  H01L23/495

CPC classification number: H05K3/3426 ,  H01L23/66 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0237 ,  H05K3/3421 ,  Y02P70/613

Abstract: An enclosure assembly for a high frequency integrated circuit. The enclosure assembly includes a plurality of lead terminals that are part of a lead frame. The lead terminals are connected to electrical ports of the circuit within the enclosure to connect the circuit to other integrated circuits and/or to a printed circuit board. A portion of the lead terminals outside of the enclosure has a specially shaped flared region that establishes the characteristic impedance of the circuit on the lead lines outside of the enclosure.

Abstract translation: 一种用于高频集成电路的外壳组件。 外壳组件包括作为引线框的一部分的多个引线端子。 引线端子连接到外壳内的电路的电气端口，以将电路连接到其他集成电路和/或印刷电路板。 外壳外部的引线端子的一部分具有特殊形状的扩口区域，其建立在外壳外部的引线上的电路的特性阻抗。

公开(公告)号：US5956840A

公开(公告)日：1999-09-28

申请号：US971155

申请日：1997-11-14

Applicant: Steven S. Chan ,  John E. Dowsing, III ,  Jason E. Snodgress

Inventor： Steven S. Chan ,  John E. Dowsing, III ,  Jason E. Snodgress

IPC: H01L23/12 ,  H01L23/66 ,  H01P1/08 ,  H01P11/00

CPC classification number: H01L23/66 ,  H01P1/08 ,  H01L2924/0002 ,  Y10T29/49016

Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.