公开(公告)号：US5402003A

公开(公告)日：1995-03-28

申请号：US151327

申请日：1993-11-12

Applicant: George W. McIver ,  Paula R. Hurt ,  John E. Dowsing, III

Inventor： George W. McIver ,  Paula R. Hurt ,  John E. Dowsing, III

IPC: H01L23/13 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H01L27/10 ,  H01L27/15

CPC classification number: H05K1/024 ,  H01L23/13 ,  H01L23/5381 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0195 ,  H05K2201/0715

Abstract: A substrate applicable to be used in a multichip module including a plurality of integrated circuits. The substrate includes a series of interrelated metal layers, ceramic layers and lattice structures formed by the ceramic layers. The metal layers provide ground planes, power planes and interconnects for the integrated circuit. The lattice structure consists of a series of ceramic regions separating the ceramic layers such that the majority of the lattice structure is air in order to reduce the effective dielectric constant of the substrate.

Abstract translation: 一种可应用于包括多个集成电路的多芯片模块的基板。 衬底包括由陶瓷层形成的一系列相互关联的金属层，陶瓷层和晶格结构。 金属层为集成电路提供接地层，电源层和互连。 晶格结构由分离陶瓷层的一系列陶瓷区域组成，使得大部分晶格结构是空气，以便降低衬底的有效介电常数。