发明授权
US5403869A Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
失效
环氧树脂，环氧改性聚丁二烯和光引发剂的粘合剂
- 专利标题： Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
- 专利标题（中）： 环氧树脂，环氧改性聚丁二烯和光引发剂的粘合剂
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申请号： US107115申请日： 1993-08-17
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公开(公告)号： US5403869A公开(公告)日： 1995-04-04
- 发明人: Shigeharu Arike , Yorio Iwasaki , Eiichi Shinada , Toshiro Okamura , Kanji Murakami , Yuichi Nakazato
- 申请人： Shigeharu Arike , Yorio Iwasaki , Eiichi Shinada , Toshiro Okamura , Kanji Murakami , Yuichi Nakazato
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-217814 19920817; JPX5-164525 19930702
- 主分类号： C08G59/32
- IPC分类号： C08G59/32 ; C08G59/34 ; C08G59/38 ; C08G59/68 ; C09J163/00 ; H05K3/10 ; H05K3/38 ; H05K3/46 ; C08G59/06 ; C08L63/02 ; C08L63/08
摘要：
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
公开/授权文献
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