公开(公告)号：US5584121A

公开(公告)日：1996-12-17

申请号：US463745

申请日：1995-06-05

申请人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

发明人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

IPC分类号： C08G59/32 ,  C08G59/34 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  B32B31/00

CPC分类号： C08G59/027 ,  C08G59/32 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  Y10S428/901 ,  Y10T29/49162

摘要： An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

摘要翻译： 一种粘合剂，其包含（a）分子量为5000以上的固体环氧树脂，（b）具有至少三个环氧基的多官能环氧树脂，（c）具有至少三个环氧基的分子内环氧改性聚丁二烯，（d） 阳离子光引发剂和（e）特殊重量比的锡化合物，对于制造具有良好耐热性，耐溶剂性的多种线路板有效，其中粘合剂层不具有空隙并且防止绝缘包封线的移动。

公开(公告)号：US5486655A

公开(公告)日：1996-01-23

申请号：US345457

申请日：1994-11-21

申请人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

发明人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

IPC分类号： C08G59/32 ,  C08G59/34 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02

CPC分类号： C08G59/027 ,  C08G59/32 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  Y10S428/901 ,  Y10T29/49162

摘要： An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

摘要翻译： 一种粘合剂，其包含（a）分子量为5000以上的固体环氧树脂，（b）具有至少三个环氧基的多官能环氧树脂，（c）具有至少三个环氧基的分子内环氧改性聚丁二烯，（d） 阳离子光引发剂和（e）特殊重量比的锡化合物，对于制造具有良好耐热性，耐溶剂性的多种线路板有效，其中粘合剂层不具有空隙并且防止绝缘包封线的移动。

公开(公告)号：US5403869A

公开(公告)日：1995-04-04

申请号：US107115

申请日：1993-08-17

申请人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

发明人： Shigeharu Arike ,  Yorio Iwasaki ,  Eiichi Shinada ,  Toshiro Okamura ,  Kanji Murakami ,  Yuichi Nakazato

IPC分类号： C08G59/32 ,  C08G59/34 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  C08G59/06 ,  C08L63/02 ,  C08L63/08

CPC分类号： C08G59/027 ,  C08G59/32 ,  C08G59/38 ,  C08G59/68 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  Y10S428/901 ,  Y10T29/49162

摘要： An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

摘要翻译： 一种粘合剂，其包含（a）分子量为5000以上的固体环氧树脂，（b）具有至少三个环氧基的多官能环氧树脂，（c）具有至少三个环氧基的分子内环氧改性的聚丁二烯，（d ）阳离子型光引发剂，（e）特殊重量比的锡化合物，对生产具有良好耐热性，耐溶剂性的多线布线板有效，并且其中粘合层没有空隙并且防止绝缘封装线的移动。

公开(公告)号：US5323534A

公开(公告)日：1994-06-28

申请号：US27803

申请日：1993-03-08

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K7/06 ,  H01K3/10

CPC分类号： H05K1/0219 ,  H05K3/429 ,  H05K7/06 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  Y10T29/49162

摘要： A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

摘要翻译： 一种同轴导体互连线路板，其特征在于具有至少一个内壁金属化导电孔，用于将同轴导体的导电屏蔽连接到接地层，或具有用于连接接地层或将导电屏蔽连接到接地层的连接金属层，以及 用于将同轴导体的中心信号导体与其他电路连接的内壁金属化导电孔在防止串扰噪声和屏蔽效果方面是优异的。

公开(公告)号：US5233133A

公开(公告)日：1993-08-03

申请号：US735266

申请日：1991-07-24

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K7/06

CPC分类号： H05K1/0219 ,  H05K3/429 ,  H05K7/06 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  Y10T29/49162

摘要： A coaxial conductor interconnection wiring board includes at least one coaxial conductor and at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor. The conductive shield of the coaxial conductor is connected to the ground layer by connection metal layers. A conductor insulating layer surrounds the metallized conductor hole and the connection metal layers surround a part of the additional conductor insulating layer. Thus, the conductive hole, insulating layer, and connection metal layers function as a coaxial conductor.

公开(公告)号：US5053280A

公开(公告)日：1991-10-01

申请号：US408688

申请日：1989-09-18

申请人： Shin Takanezawa ,  Yorio Iwasaki ,  Hiroshi Takaahashi ,  Toshiro Okamura ,  Saburo Amano ,  Hiroyoshi Yokoyama ,  Noriyoshi Fukuoka ,  Tatsuya Amano

发明人： Shin Takanezawa ,  Yorio Iwasaki ,  Hiroshi Takaahashi ,  Toshiro Okamura ,  Saburo Amano ,  Hiroyoshi Yokoyama ,  Noriyoshi Fukuoka ,  Tatsuya Amano

IPC分类号： C09J113/00 ,  C09J163/00 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38

CPC分类号： H05K3/181 ,  C09J113/00 ,  C09J163/00 ,  C23C18/1605 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/24 ,  C23C18/30 ,  C23C18/38 ,  H05K3/387 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511

摘要： An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.

公开(公告)号：US4216246A

公开(公告)日：1980-08-05

申请号：US905398

申请日：1978-05-12

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Akishi Nakaso ,  Nobuo Uozu ,  Hiroshi Takahashi

IPC分类号： C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  B05D3/06

CPC分类号： H05K3/387 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2086 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181

摘要： A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.

摘要翻译： 通过形成包含（A）橡胶材料的新型粘合剂层和（B）按照式20所定义的比例存在的热固性树脂，改善基材表面和无电镀在其上的金属沉积物之间的粘附性的方法

公开(公告)号：US6064111A

公开(公告)日：2000-05-16

申请号：US903996

申请日：1997-07-31

申请人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

发明人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

IPC分类号： H01L23/02 ,  H01L23/498 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

摘要翻译： 本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。 布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。 在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。 绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

公开(公告)号：US4791238A

公开(公告)日：1988-12-13

申请号：US32247

申请日：1987-03-31

申请人： Masao Kanno ,  Naoki Fukutomi ,  Yorio Iwasaki ,  Fujio Kojima ,  Hidehiro Nakamura

发明人： Masao Kanno ,  Naoki Fukutomi ,  Yorio Iwasaki ,  Fujio Kojima ,  Hidehiro Nakamura

IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K3/10 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06 ,  H05K3/00

CPC分类号： H05K7/06 ,  H05K1/0289 ,  H05K2201/09609 ,  H05K3/10 ,  Y10T29/49128

摘要： A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.

摘要翻译： 通过在主网格的质心位置设置辅助栅格，通过在倾斜方向上以布线方式主要代替在XY方向的布线而获得的高密度布线电路板主要可以使电线和通孔之间的空间大 而不会缩小布线间距。

公开(公告)号：US06236108B1

公开(公告)日：2001-05-22

申请号：US09541041

申请日：2000-03-31

申请人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

发明人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

IPC分类号： H01L23495

CPC分类号： H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

摘要翻译： 本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。 布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。 在绝缘支撑基板的一部分上还设置有开口，其中每个布线形成在绝缘支撑基板上，绝缘支撑基板是设置有内部连接的外部连接的部分。 绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。