发明授权
US5468999A Liquid encapsulated ball grid array semiconductor device with fine pitch
wire bonding
失效
液体封装球栅阵列半导体器件，具有精细节距引线接合
- 专利标题： Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding
- 专利标题（中）： 液体封装球栅阵列半导体器件，具有精细节距引线接合
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申请号： US249602申请日： 1994-05-26
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公开(公告)号： US5468999A公开(公告)日： 1995-11-21
- 发明人: Paul T. Lin , Michael B. McShane
- 申请人： Paul T. Lin , Michael B. McShane
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L23/24
- IPC分类号： H01L23/24 ; H01L23/31 ; H01L23/02 ; H01L23/12 ; H01L23/48
摘要：
A ball grid array semiconductor device (10) includes a package substrate (14 or 16) having a plurality of conductive traces (18), bond posts (20), and conductive vias (22). A semiconductor die (12) is mounted to the package substrate. Orthogonal wire bonds (28) are used to electrically connect staggered bond pads (26) to corresponding bond posts (20) on the substrate. A liquid encapsulant (40) is used to cover the die, the wire bonds, and portions of the package substrate. In another embodiment, a package substrate (50) includes a lower bonding tier (52) and an upper bonding tier (54). Wire bonds (60) are used to electrically connect an outer row of bond pads (64) to bond posts (20) of lower tier (52), while wire bonds (62) are used to electrically connect an inner row of bond pads (64) to bond posts (20) of an upper tier (54). The loop height of wire bonds (60) is smaller than that of wire bonds (62).
公开/授权文献
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