发明授权
- 专利标题： Multiple wire adhesive on a multiple wire wiring board
- 专利标题（中）： 多线接线板上有多根线胶
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申请号： US345457申请日： 1994-11-21
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公开(公告)号： US5486655A公开(公告)日： 1996-01-23
- 发明人: Shigeharu Arike , Yorio Iwasaki , Eiichi Shinada , Toshiro Okamura , Kanji Murakami , Yuichi Nakazato
- 申请人： Shigeharu Arike , Yorio Iwasaki , Eiichi Shinada , Toshiro Okamura , Kanji Murakami , Yuichi Nakazato
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-217814 19920817; JPX5-164525 19930702
- 主分类号： C08G59/32
- IPC分类号： C08G59/32 ; C08G59/34 ; C08G59/38 ; C08G59/68 ; C09J163/00 ; H05K3/10 ; H05K3/38 ; H05K3/46 ; H05K1/02
摘要：
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
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