发明授权
- 专利标题： Adhesive tape for electronic parts and liquid adhesive
- 专利标题（中）： 电子部件和液体胶粘剂胶带
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申请号： US326428申请日： 1994-10-20
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公开(公告)号： US5500294A公开(公告)日： 1996-03-19
- 发明人: Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
- 申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
- 申请人地址： JPX Tokyo
- 专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX5-286205 19931022
- 主分类号： C08G73/12
- IPC分类号： C08G73/12 ; C09J4/00 ; C09J4/02 ; C09J7/00 ; C09J7/02 ; C09J109/02 ; C09J119/00 ; C09J121/00 ; C09J179/04 ; C09J179/08 ; H01L21/301 ; H01L21/52 ; H01L23/29 ; H01L23/31 ; H05K13/00 ; C09J133/20
摘要：
This invention is to provide a liquid adhesive can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving(a) a butadiene-acrylonitrile copolymer having piperazinylethylaminocarbonyl groups at both terminals and having a weight average molecular weight of 1,000-50,000, and an acrylonitrile content of 5-50% by weight, represented by the following formula (I): ##STR1## wherein, m=50-95, and n=5-50; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
公开/授权文献
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