公开(公告)号：US5663287A

公开(公告)日：1997-09-02

申请号：US609322

申请日：1996-03-01

Applicant: Osamu Oka ,  Takeshi Hashimoto ,  Takeshi Nishigaya ,  Tatsuya Hariko

Inventor： Osamu Oka ,  Takeshi Hashimoto ,  Takeshi Nishigaya ,  Tatsuya Hariko

IPC: C08G73/10

CPC classification number: C08G73/106 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1064

Abstract: The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. ##STR1## wherein X is --SO.sub.2 -- or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, and R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.

Abstract translation: 本发明提供一种可溶于有机溶剂且耐热性优异的新型聚酰亚胺，以及聚酰亚胺的制造方法。 本发明的聚酰亚胺包含由式（1）表示的重均单元，数均分子量为4,000〜200,000。 （1）其中X是-SO 2 - 或-C（= O）-OCH 2 CH 2 O-C（= O） - ，并且R 1，R 2，R 3和R 4独立地是具有1至4个碳原子的烷基或 具有1至4个碳原子的烷氧基。

公开(公告)号：US5510189A

公开(公告)日：1996-04-23

申请号：US462365

申请日：1995-06-05

Applicant: Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

Inventor： Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC: C09J4/00 ,  C09J7/00 ,  C09J7/02 ,  C09J109/02 ,  C09J121/00 ,  H01L21/301 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31 ,  H05K13/00 ,  B32B9/04

CPC classification number: C09J109/02 ,  C09J7/0203 ,  H01L24/29 ,  C08K5/3415 ,  C08K5/544 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31931

Abstract: This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

Abstract translation: 本发明提供一种本发明的液体粘合剂可以在相对低的温度下粘合和固化，并且具有足够的耐热性和可靠性等，以及使用它们的粘合带。 本发明的液体粘合剂可通过将（a）重均分子量为10,000-200,000，丙烯腈含量为5-50重量％，氨基当量为500-200重量％的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物， 10,000，由下式（I）表示：其中，k，m和n为摩尔比，n为1，k为3-175的数，m为0.3的数 至93; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。 将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

公开(公告)号：US06228452B1

公开(公告)日：2001-05-08

申请号：US09015334

申请日：1998-01-29

Applicant: Osamu Oka ,  Takeshi Nishigaya ,  Jun Tochihira ,  Fumiki Komagata

Inventor： Osamu Oka ,  Takeshi Nishigaya ,  Jun Tochihira ,  Fumiki Komagata

IPC: C09J702

CPC classification number: C09J7/28 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2479/08 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T428/1476 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2896 ,  H01L2924/00014

Abstract: This invention provide an adhesive tape for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises a metal substrate, an adhesive layer A and an adhesive layer B laminated in order, wherein said adhesive layers A and B are resin layers composed of 100-40% by mol of at least a polyimide comprising the repeating unit represented by the formula (1) and 0-60% by mol of the repeating unit represented by the formula (2), said two adhesive layers having each a different glass transition temperature: wherein X is —SO2— and/or —C(=O)—OCH2CH2O—C(=O)—, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, and n means an integer of 1 to 20.

Abstract translation: 本发明提供一种具有足够热阻和可靠性的电子部件用胶带。 粘合带包括金属基材，粘合剂层A和依次层压的粘合剂层B，其中所述粘合剂层A和B是至少包含100-40摩尔％的至少一种聚酰亚胺的树脂层，所述聚酰亚胺包含由 所述两个粘合剂层具有不同的玻璃化转变温度：其中X是-SO 2 - 和/或-C（= O），所述式（1）和0-60摩尔％由式（2）表示的重复单元， ）-OCH 2 CH 2 O-C（= O） - ，Ar为含有芳环的二价基团，R为碳原子数1〜10的亚烷基或-CH 2 OC 6 H 4 - ，n表示1〜20的整数。

公开(公告)号：US5725948A

公开(公告)日：1998-03-10

申请号：US704068

申请日：1996-08-28

Applicant: Osamu Oka ,  Takeshi Nishigaya

Inventor： Osamu Oka ,  Takeshi Nishigaya

IPC: C08G73/12 ,  C09J7/02 ,  C09J179/08 ,  H01L21/58 ,  H01L23/29 ,  H01L23/31 ,  B32B7/12 ,  B32B9/04 ,  B32B15/08 ,  B32B27/00

CPC classification number: H01L24/83 ,  C08G73/124 ,  C08G73/125 ,  C08G73/127 ,  C09J7/0242 ,  C09J7/0282 ,  H01L24/32 ,  C09J2479/08 ,  C09J2479/086 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2887 ,  Y10T428/31663 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: This invention provides an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape of the invention comprises an adhesive layer composed of at least a polyimide selected from (I) a polyimide comprising the repeating unit represented by the following formula (1), (II) a polyimide comprising the repeating unit represented by the following formula (2), and (III) a polyimide comprising the repeating units represented by the following formulas (1) and (2) in a suitable proportion, provided on at least one surface of a heat resistance film or on a surface of a release film: ##STR1## wherein Ar is a divalent group having aromatic rings, Ra is a divalent group having 2 to 6 benzene rings; Rb is an alkylene group having 2 to 20 carbon atoms, a specific ether group or a specific dimethylsiloxane group: X.sup.1 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group) or S; and X.sup.2 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group), ##STR2## or S.

Abstract translation: 本发明提供一种具有足够热阻和可靠性的电子部件的胶带和液体粘合剂。 本发明的胶带包括由至少选自（I）聚酰亚胺组成的聚酰亚胺的聚酰亚胺，所述聚酰亚胺包含由下式（1）表示的重复单元，（II），包含由下式 （2）表示的聚酰亚胺和（III）以适当比例包含由下式（1）和（2）表示的重复单元的聚酰亚胺，其设置在耐热膜的至少一个表面上或剥离膜的表面上 ：具有芳环的取代基，Ra是具有2〜6个苯环的二价基团; Rb是碳原子数2〜20的亚烷基，特定的醚基或特定的二甲基硅氧烷基：X1是NH，NR（R是C1-C4烷基或烷氧基）或S; 并且X 2是NH，NR（R是C 1 -C 4烷基或烷氧基），IMAGE或S.

公开(公告)号：US5696235A

公开(公告)日：1997-12-09

申请号：US649565

申请日：1996-05-17

Applicant: Osamu Oka ,  Takeshi Hashimoto ,  Takeshi Nishigaya

Inventor： Osamu Oka ,  Takeshi Hashimoto ,  Takeshi Nishigaya

IPC: C08G73/10 ,  C08G73/12 ,  C08G69/26

CPC classification number: C08G73/126 ,  C08G73/1064 ,  C08G73/124

Abstract: Novel polyimides which are soluble in various organic solvents and excellent in thermal resistance, processability are disclosed. The polyimides comprise repeating units represented by the following formula (1) and/or (2) and having a number average molecular weight of 4,000-200,000. ##STR1## wherein Ar is a divalent group represented by the following formula (2) or (3): ##STR2## wherein Y is --O--, --CO--, --S--, --SO.sub.2 -- or --C(CH.sub.3).sub.2 --, ##STR3## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group, Ra is a divalent group having 2-6 benzene rings, X.sup.1 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group) or S, Rb is C.sub.2-20 alkylene group, ether group or dimethylsiloxane group, and X.sub.2 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group), ##STR4##

Abstract translation: 公开了可溶于各种有机溶剂的新型聚酰亚胺，耐热性，加工性优异。 聚酰亚胺包含由下式（1）和/或（2）表示的数均分子量为4,000-200,000的重复单元。 （1）由下式（2）或（3）表示：其中Y是-O - ， - CO - ， - S - ， - SO 2 - 或-C（CH 3）2 - ，其中R 1，R 2，R 3和R 4各自为C 1-4烷基或C 1-4烷氧基，R a为具有2-6个苯环的二价基团，X 1表示NH，NR（ 其中R是C 1-4烷基或C 1-4烷氧基）或S，R b是C 2-20亚烷基，醚基或二甲基硅氧烷基，X 2表示NH，NR（其中R是C 1-4烷基 或C 1-4烷氧基），

公开(公告)号：US5609956A

公开(公告)日：1997-03-11

申请号：US623090

申请日：1996-03-28

Applicant: Yukinori Sakumoto ,  Takeshi Hashimoto ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

Inventor： Yukinori Sakumoto ,  Takeshi Hashimoto ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC: C09J7/00 ,  C08F220/60 ,  C08F279/00 ,  C08F279/02 ,  C08G73/00 ,  C08G77/26 ,  C09J7/02 ,  C09J109/02 ,  C09J119/00 ,  C09J121/00 ,  C09J133/02 ,  C09J133/20 ,  C09J133/24 ,  H01L21/52 ,  H01L23/40 ,  B32B7/10 ,  B32B27/28

CPC classification number: C09J109/02 ,  C09J119/006 ,  C08K5/3415 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  Y10T428/1452 ,  Y10T428/1457 ,  Y10T428/1476 ,  Y10T428/24942 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2887 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31797 ,  Y10T428/31895

Abstract: Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of:(a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and(b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure.

Abstract translation: 在相对较低的温度下可以粘附和固化的胶带在粘附到半导体器件的引线框架的情况下保持足够的电绝缘。 粘合带包括脱模膜和设置在所述脱模膜的表面上的粘合剂层，所述粘合剂层半固化成B阶段，并由以下组成：（a）具有重量的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物 平均分子量为10,000-200,000，丙烯腈含量为5-50重量％，氨基当量为500-10,000，由式（I）表示：其中k，m和n分别为 以n为1，k为3-175的数，m为0.3〜93的数; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内，所述粘合剂层由 至少两个具有不同半固化状态的半固化层。

公开(公告)号：US5500294A

公开(公告)日：1996-03-19

申请号：US326428

申请日：1994-10-20

Applicant: Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

Inventor： Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC: C08G73/12 ,  C09J4/00 ,  C09J4/02 ,  C09J7/00 ,  C09J7/02 ,  C09J109/02 ,  C09J119/00 ,  C09J121/00 ,  C09J179/04 ,  C09J179/08 ,  H01L21/301 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31 ,  H05K13/00 ,  C09J133/20

CPC classification number: C09J7/0203 ,  C09J119/006 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  Y10T428/2883 ,  Y10T428/2887 ,  Y10T428/2896

Abstract: This invention is to provide a liquid adhesive can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving(a) a butadiene-acrylonitrile copolymer having piperazinylethylaminocarbonyl groups at both terminals and having a weight average molecular weight of 1,000-50,000, and an acrylonitrile content of 5-50% by weight, represented by the following formula (I): ##STR1## wherein, m=50-95, and n=5-50; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

Abstract translation: 本发明提供一种液体粘合剂可以在较低的温度下粘附和固化并且具有足够的耐热性和可靠性等，以及使用其的胶带。 本发明的液体粘合剂可通过以下方式获得：（a）在两端具有哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物，其重均分子量为1,000-50,000，丙烯腈含量为5-50重量％，以 下式（I）：其中m = 50-95，n = 5-50; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。 将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

公开(公告)号：US5428113A

公开(公告)日：1995-06-27

申请号：US324542

申请日：1994-10-18

Applicant: Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

Inventor： Yukinori Sakumoto ,  Takeshi Hashimoto ,  Katsuji Nakaba ,  Masaharu Kobayashi ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC: C08C19/36 ,  C08F8/30 ,  C08F8/32 ,  C08F20/52 ,  C08F220/60 ,  C08F236/04 ,  C09J133/20 ,  C09J147/00

CPC classification number: C08F8/30 ,  C08C19/36

Abstract: The piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of this invention is a novel substance useful as an adhesive component for adhesive tapes, which tapes are used in the interior of a resin-sealed type semiconductor device. The copolymer has a weight average molecular weight of 10,000-200,000, and is represented by the following general formula (I) and obtained by condensing a carboxyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000 with N-aminoethylpiperazine in the presence of a phosphite and a pyridine derivative to undergo the amidation. ##STR1## wherein k, m, and n indicate molar proportions, where n is taken as 1, k is a number in the range of 3-175, and m is a number in the range of 0.3-93.

Abstract translation: 本发明的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物是用作粘合带的粘合剂组分的新型物质，这些胶带用于树脂密封型半导体器件的内部。 共聚物的重均分子量为10,000〜200,000，由以下通式（I）表示，通过将重均分子量为10,000〜200,000的含羧基的丁二烯 - 丙烯腈共聚物与N-氨基乙基哌嗪 在亚磷酸盐和吡啶衍生物的存在下进行酰胺化。 （I）其中k，m和n表示摩尔比例，其中n取为1，k为3-175范围内的数，m为0.3-93范围内的数。

公开(公告)号：US6045886A

公开(公告)日：2000-04-04

申请号：US998019

申请日：1997-12-24

Applicant: Osamu Oka ,  Takeshi Nishigaya

Inventor： Osamu Oka ,  Takeshi Nishigaya

IPC: C09J7/02 ,  C09J179/08 ,  H01L23/495 ,  B32B7/12 ,  H01L23/29

CPC classification number: H01L24/49 ,  C09J179/08 ,  C09J7/0246 ,  H01L23/4951 ,  C09J2201/128 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2479/08 ,  C09J2479/086 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T428/1462 ,  Y10T428/1481 ,  Y10T428/24942 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663 ,  Y10T428/31721

Abstract: This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises adhesive layers composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2) on both sides of the substrate, one of said adhesive layer having a higher glass transition temperature than that of the other adhesive layer: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--,Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.The stustrate may be a resin layer composed of the above mentioned polyimide.

Abstract translation: 本发明提供一种具有足够热阻和可靠性的电子部件的胶带和液体粘合剂。 粘合带包括由至少一层包含由式（1）和（2）表示的重复单元构成的聚酰亚胺构成的粘合剂层，所述粘合剂层的玻璃化转变温度比其它粘合剂层高 粘合剂层：其中X是-SO 2 - 和/或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar是含有芳环的二价基团，R是具有1-10个碳原子的亚烷基或 -CH 2 OC 6 H 4 - ，n表示1〜20的整数。残留物可以是由上述聚酰亚胺构成的树脂层。

公开(公告)号：US5866250A

公开(公告)日：1999-02-02

申请号：US704160

申请日：1996-08-28

Applicant: Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

Inventor： Osamu Oka ,  Takeshi Nishigaya ,  Fumiyoshi Yamanashi

IPC: C09J7/02 ,  C08G73/10 ,  C09D179/08 ,  C09J179/08 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09D179/08 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/106 ,  C08G73/1064 ,  C09J179/08 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/181 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2887

Abstract: This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.

Abstract translation: 本发明提供一种具有足够热阻和可靠性的电子部件的胶带和液体粘合剂。 粘合带包括至少由包含由式（1）和（2）表示的重复单元的聚酰亚胺构成的粘合剂层，其设置在耐热膜或脱模膜的表面上：图像 >（2）其中X是-SO 2 - 和/或-C（= O）-OCH 2 CH 2 O-C（= O） - ，Ar是含有芳环的二价基团，R是具有1-10个碳原子的亚烷基 或-CH 2 OC 6 H 4 - ，n表示1〜20的整数。