发明授权
- 专利标题： Sheet molding compounds, production processes therefor, and molded materials therefrom
- 专利标题（中）： 片状成型用化合物，其制造方法及其成型材料
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申请号： US227589申请日： 1994-04-14
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公开(公告)号： US5506039A公开(公告)日： 1996-04-09
- 发明人: Yoshiro Kimura , Fumiyoshi Yamada , Kiyotaka Nakai
- 申请人： Yoshiro Kimura , Fumiyoshi Yamada , Kiyotaka Nakai
- 申请人地址： JPX Tokyo JPX Kariya
- 专利权人： Dainippon Ink and Chemicals, Inc.,Aisin Seiki Kabushiki Kaisha
- 当前专利权人： Dainippon Ink and Chemicals, Inc.,Aisin Seiki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo JPX Kariya
- 优先权： JPX63-54055 19880308
- 主分类号： B29B11/16
- IPC分类号： B29B11/16 ; B29C70/02 ; B29C70/12 ; B29C70/50 ; B29C70/58 ; B29K105/12 ; B29K105/16 ; B32B5/14 ; B32B7/02 ; B32B27/20 ; C08J5/24 ; C08J9/32 ; C08K7/22 ; B32B3/26 ; B32B5/16
摘要：
Sheet molding compounds which comprising two layers, one being a sheet molding compound layer containing a hollow, lightweight filler particles (referred to as Type A layer) and the other being another type of sheet molding compound layer not containing lightweight, hollow filler particles (referred to as Type B layer), with the above-mentioned Type A and Type B layers making up a consistently integrated structure.
公开/授权文献
- US4982108A Low current CMOS translator circuit 公开/授权日：1991-01-01