发明授权
- 专利标题： Aperture plate and a method of manufacturing the same
- 专利标题（中）： 孔板及其制造方法
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申请号： US260369申请日： 1994-06-14
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公开(公告)号： US5520297A公开(公告)日： 1996-05-28
- 发明人: Teruyuki Kagami , Sakae Yaita , Niro Katane , Mitsuo Tanabe , Yoshinori Nakayama , Hidetoshi Satoh
- 申请人： Teruyuki Kagami , Sakae Yaita , Niro Katane , Mitsuo Tanabe , Yoshinori Nakayama , Hidetoshi Satoh
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX5-151684 19930623
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; G03F1/20 ; G03F1/40 ; B44C1/22 ; C25F3/00
摘要：
A semiconductor substrate has a plurality of chip portions and chip separating portions for partitioning the plurality of chip portions into each other. The plurality of chip portions and the separating portions are etched on one side of the semiconductor substrate so that each of the plurality of chip portions is provided with stencil patterns. Furthermore, the plurality of chip portions and chip separating portions are etched on the other side of the semiconductor substrate so that the stencil patterns are exposed and the plurality of chip portions are capable of being substantially separated from each other.
公开/授权文献
- USD311082S Cart for refuse containers 公开/授权日：1990-10-02
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