发明授权
- 专利标题： Microelectronic component
- 专利标题（中）： 微电子元件
-
申请号： US365932申请日： 1994-12-29
-
公开(公告)号： US5540977A公开(公告)日： 1996-07-30
- 发明人: Thomas Vogelsang , Wolfgang Roesner
- 申请人： Thomas Vogelsang , Wolfgang Roesner
- 申请人地址： DEX Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DEX Munich
- 优先权： DEX4401422.2 19940119
- 主分类号： H01L29/06
- IPC分类号： H01L29/06 ; G11C11/401 ; H01L21/28 ; H01L29/15 ; H01L29/16 ; H01L29/66 ; H01L29/78 ; H01L29/88 ; H01L45/00 ; H01L51/30
摘要：
A microelectronic component has a substrate on which a layer structure and at least two contact structures are arranged. The layer structure and the contact structures are electrically connected to one another but are electrically insulated from the substrate. The layer structure is formed by one layer of individual elements that are electrically connected to one another via quantum-mechanical tunnel contacts.
公开/授权文献
- US6153156A Method for purifying leady oxides 公开/授权日：2000-11-28
信息查询
IPC分类:
