摘要:
A microelectronic component has a substrate on which a layer structure and at least two contact structures are arranged. The layer structure and the contact structures are electrically connected to one another but are electrically insulated from the substrate. The layer structure is formed by one layer of individual elements that are electrically connected to one another via quantum-mechanical tunnel contacts.
摘要:
In a method for manufacturing a single electron component in MOS technique, an active zone provided with a gate dielectric is defined in a silicon substrate. With assistance of a fine-structuring method, particularly with electron beam lithography, a first gate level is generated with fine structures
摘要:
Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TS V to at least one of a test input and a test evaluation circuit.
摘要:
A memory die for use in a multi-die stack having at least one other die. The memory die includes a plurality of contacts arranged in a field and configured to interface to the other dies of the multi-die stack. A first subset of the buffer lines of a number of buffer lines are connected to respective contacts in the field. The memory die also includes a number of buffers and cross-bar lines. The buffers are coupled between respective signal lines and respective buffer lines. The cross-bar lines interconnect respective pairs of buffer lines in a second subset of the buffer lines that is distinct from the first subset of the buffer lines.
摘要:
A memory system includes wordlines and pairs of complementary bitlines that provide access to memory storage elements. Capacitive and resistive loads associated with wordlines and bitlines are driven relatively slowly between voltage levels to reduce peak current, and thus power dissipation. Power dissipation is further reduced by charging complementary bitlines at substantially different rates.
摘要:
The disclosed embodiments provide a sense amplifier for a dynamic random-access memory (DRAM). This sense amplifier includes a bit line to be coupled to a cell to be sensed in the DRAM, and a complement bit line which carries a complement of a signal on the bit line. The sense amplifier also includes a p-type field-effect transistor (PFET) pair comprising cross-coupled PFETs that selectively couple either the bit line or the complement bit line to a high bit-line voltage. The sense amplifier additionally includes an n-type field effect transistor (NFET) pair comprising cross-coupled NFETs that selectively couple either the bit line or the complement bit line to ground. This NFET pair is lightly doped to provide a low threshold-voltage mismatch between NFETs in the NFET pair. In one variation, the gate material for the NFETs is selected to have a work function that compensates for a negative threshold voltage in the NFETs which results from the light substrate doping. In another variation, the sense amplifier additionally includes a cross-coupled pair of latching NFETs. These latching NFETs are normally doped and are configured to latch the voltage on the bit line after the lightly doped NFETs finish sensing the voltage on the bit line.
摘要:
The disclosed embodiments provide a dynamic memory device, comprising a set of dynamic memory cells and a set of replacement dynamic memory cells. The set of replacement dynamic memory cells includes data cells which contain replacement data bits for predetermined faulty cells in the set of dynamic memory cells, and address cells which contain address bits identifying the faulty cells, wherein each data cell is associated with a group of address cells that identify an associated faulty cell in the set of dynamic memory cells. The dynamic memory device also includes a remapping circuit, which remaps a faulty cell in the set of dynamic memory cells to an associated replacement cell in the set of replacement cells.
摘要:
A method and apparatus for operating a component including a memory device. The method includes receiving a plurality of commands and determining if a set of the plurality of commands matches a predefined pattern of commands configured to place the memory device into a test mode. Upon determining that the set of the plurality of commands matches the predefined plurality of commands, the memory device is placed in the test mode.
摘要:
Methods and apparatus for a more precise readout of fuse resistance than a conventional binary readout are provided. For some embodiments, a digital readout of fuse resistance may be obtained by selectively altering an effective reference resistance to which the fuse resistance is compared. For some embodiments, a direct analog readout may be obtained in addition to, or instead of, a digital resistance readout.
摘要:
Embodiments of the invention provide a method and apparatus for accessing a twin cell memory device. In one embodiment, a twin memory cell is accessed using a first bitline and a second bitline. The method includes precharging the first bitline and the second bitline to a low voltage. A wordline voltage is asserted to access the twin memory cell. A voltage difference between the first and second bitline is created by a data value and a complement of the data value stored in the twin memory cell, and the voltage difference is sensed.