发明授权
US5541135A Method of fabricating a flip chip semiconductor device having an inductor
失效
制造具有电感器的倒装芯片半导体器件的方法
- 专利标题： Method of fabricating a flip chip semiconductor device having an inductor
- 专利标题（中）： 制造具有电感器的倒装芯片半导体器件的方法
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申请号： US452784申请日： 1995-05-30
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公开(公告)号： US5541135A公开(公告)日： 1996-07-30
- 发明人: Michael J. Pfeifer , George W. Marlin
- 申请人： Michael J. Pfeifer , George W. Marlin
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/60 ; H01L21/822 ; H01L23/485 ; H01L27/04 ; H01L21/70
摘要：
Flip chip bumps (24, 26, and 27) and an inductor (17) are simultaneously fabricated on a semiconductor substrate (10). The fabrication process includes two electroplating steps. The first step electroplates copper (18) onto a seed layer (13) to form the inductor (17) and a first portion (16) of the flip chip bumps (24, 26, and 27). The second step electroplates copper (21) onto the previously electroplated copper (18) to form a second portion (21) of the flip chip bumps (24, 26, and 27).
公开/授权文献
- US5004288A Sun visor for motor vehicle having a slidable main body 公开/授权日：1991-04-02
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