发明授权
- 专利标题： Process of wirebond pad repair and reuse
- 专利标题（中）： 丝网垫修复和再利用的过程
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申请号： US405015申请日： 1995-03-16
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公开(公告)号： US5550083A公开(公告)日： 1996-08-27
- 发明人: Masateru Koide , Yasuo Kawamura
- 申请人： Masateru Koide , Yasuo Kawamura
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 主分类号： H01L21/603
- IPC分类号： H01L21/603 ; H01L23/485 ; H05K1/11 ; H05K3/22 ; H05K3/34 ; H05K3/40 ; H01L21/283
摘要：
A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad. The step (a) may completely remove the first wire from the first pad, and the step (b) may form the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire. On the other hand, the step (a) may cut the first wire so that a tip end of the first wire remains bonded on the first pad, and the step (b) may form the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.
公开/授权文献
- US1284694A Gas-producer. 公开/授权日：1918-11-12
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