公开(公告)号：US5550083A

公开(公告)日：1996-08-27

申请号：US405015

申请日：1995-03-16

申请人： Masateru Koide ,  Yasuo Kawamura

发明人： Masateru Koide ,  Yasuo Kawamura

IPC分类号： H01L21/603 ,  H01L23/485 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H01L21/283

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L24/98 ,  H05K3/225 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05556 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/4911 ,  H01L2224/78313 ,  H01L2224/85214 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09736 ,  H05K2201/10287 ,  H05K2203/049 ,  H05K3/341 ,  H05K3/4015 ,  Y10S228/904

摘要： A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad. The step (a) may completely remove the first wire from the first pad, and the step (b) may form the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire. On the other hand, the step (a) may cut the first wire so that a tip end of the first wire remains bonded on the first pad, and the step (b) may form the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.

摘要翻译： 一种引线接合方法，包括以下步骤：（a）断开接合在设置在基板上的第一焊盘上的第一焊丝，（b）在第一焊盘上形成第二焊盘，以及（c）将第二焊丝接合在 第二焊盘，使得第二导线电连接到第一焊盘。 步骤（a）可以从第一焊盘完全地去除第一焊丝，并且步骤（b）可以至少在第一焊盘的顶表面上形成第二焊盘，其包括被除去第一焊丝而损坏的部分 。 另一方面，步骤（a）可以切割第一线，使得第一线的末端保持接合在第一衬垫上，并且步骤（b）可以至少在第一衬垫的顶表面上形成第二衬垫 第一焊盘，以便完全覆盖第一焊丝的剩余末端。

公开(公告)号：US5455461A

公开(公告)日：1995-10-03

申请号：US255730

申请日：1994-06-07

申请人： Masateru Koide ,  Yasuo Kawamura

发明人： Masateru Koide ,  Yasuo Kawamura

IPC分类号： H01L21/603 ,  H01L23/485 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L24/98 ,  H05K3/225 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05556 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/4911 ,  H01L2224/78313 ,  H01L2224/85214 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09736 ,  H05K2201/10287 ,  H05K2203/049 ,  H05K3/341 ,  H05K3/4015 ,  Y10S228/904

摘要： A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad. The step (a) may completely remove the first wire from the first pad, and the step (b) may form the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire. On the other hand, the step (a) may cut the first wire so that a tip end of the first wire remains bonded on the first pad, and the step (b) may form the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.

摘要翻译： 一种引线接合方法，包括以下步骤：（a）断开接合在设置在基板上的第一焊盘上的第一焊丝，（b）在第一焊盘上形成第二焊盘，以及（c）将第二焊丝接合在 第二焊盘，使得第二导线电连接到第一焊盘。 步骤（a）可以从第一焊盘完全地去除第一焊丝，并且步骤（b）可以至少在第一焊盘的顶表面上形成第二焊盘，其包括被除去第一焊丝而损坏的部分 。 另一方面，步骤（a）可以切割第一线，使得第一线的末端保持接合在第一衬垫上，并且步骤（b）可以至少在第一衬垫的顶表面上形成第二衬垫 第一焊盘，以便完全覆盖第一焊丝的剩余末端。

公开(公告)号：US20070228530A1

公开(公告)日：2007-10-04

申请号：US11544630

申请日：2006-10-10

申请人： Toshihisa Sato ,  Kenji Fukuzono ,  Masateru Koide

发明人： Toshihisa Sato ,  Kenji Fukuzono ,  Masateru Koide

IPC分类号： H01L23/495

CPC分类号： H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

摘要： A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.

摘要翻译： 导热接合材料6具有将半导体芯片1的热传递到散热器4的第一接合区域7和放松半导体芯片1和散热器4之间产生的热应力的第二接合区域8。

公开(公告)号：US20060056162A1

公开(公告)日：2006-03-16

申请号：US11020226

申请日：2004-12-27

申请人： Masateru Koide

发明人： Masateru Koide

IPC分类号： H05K1/18 ,  H01L21/4763

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/381 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/09472 ,  H05K2201/10636 ,  H05K2203/0228 ,  Y02P70/611

摘要： A laminating step includes a second step of laminating a second insulation layer on a conductive pattern last formed at a first step, roughening the surface of the laminated second insulation layer excluding a desired area, and forming a conductive layer on at least the desired area of the surface of the second insulation layer, and a processing step includes a removing step of removing an upper part of the area higher than the second insulation layer on the substrate obtained at the laminating step, and an exposing step of exposing a part of the area of a conductive pattern adjacent to the lower side of the second insulation layer.

摘要翻译： 层压步骤包括第二步骤，将第二绝缘层层压在最后形成的第一步骤的导电图案上，使层压的第二绝缘层的表面粗糙化，除去期望的区域，并且在至少所需的区域上形成导电层 第二绝缘层的表面和加工步骤包括去除在层压步骤获得的基板上高于第二绝缘层的区域的上部的去除步骤，以及暴露步骤， 的导电图案与第二绝缘层的下侧相邻。

公开(公告)号：US08546187B2

公开(公告)日：2013-10-01

申请号：US12857884

申请日：2010-08-17

申请人： Masateru Koide ,  Daisuke Mizutani

发明人： Masateru Koide ,  Daisuke Mizutani

IPC分类号： H01L21/768

CPC分类号： H01L24/17 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a multi-chip module includes: securing a plurality of chips on a surface of a flat-shaped member through a solder bump; connecting the plurality of chips with each other by a bonding wire, at surfaces, opposite to the flat-shaped member side, of the plurality of chips; and electrically connecting the plurality of chips with a board, at the surfaces, opposite to the flat-shaped member side, of the plurality of chips.

摘要翻译： 一种制造多芯片模块的方法包括：通过焊料凸块将多个芯片固定在平坦构件的表面上; 通过接合线在多个芯片的与平面形状构件侧相对的表面处将多个芯片彼此连接; 以及在所述多个芯片的与所述平坦构件侧相对的表面处，将所述多个芯片与板电连接。

公开(公告)号：US08446020B2

公开(公告)日：2013-05-21

申请号：US12902527

申请日：2010-10-12

申请人： Masateru Koide ,  Daisuke Mizutani ,  Aiichiro Inoue ,  Hideo Yamashita ,  Iwao Yamazaki ,  Masayuki Kato ,  Seiji Ueno ,  Kazuyuki Imamura

发明人： Masateru Koide ,  Daisuke Mizutani ,  Aiichiro Inoue ,  Hideo Yamashita ,  Iwao Yamazaki ,  Masayuki Kato ,  Seiji Ueno ,  Kazuyuki Imamura

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.

摘要翻译： 多芯片模块包括：板; 布线板，其布置在所述板上并且包括布线图案; 以及配置在配线基板上的多个芯片。 多个芯片中的每一个与其他芯片中的至少一个连接，并且多个芯片和板通过布线板的布线图案之外的部分彼此电连接。

公开(公告)号：US07915541B2

公开(公告)日：2011-03-29

申请号：US12099450

申请日：2008-04-08

申请人： Masateru Koide ,  Tomoyuki Abe

发明人： Masateru Koide ,  Tomoyuki Abe

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4688 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/462 ,  H05K3/4641 ,  H05K2203/1189 ,  Y10T29/49126

摘要： According to an aspect of an embodiment, a multilayer interconnection substrate includes a resin substrate layer including a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer including a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.

摘要翻译： 根据实施方案的一个方面，多层互连基板包括树脂基板层，该树脂基板层包括由树脂制成的第一绝缘层和由导电材料制成的第一互连层，陶瓷基板层包括第二绝缘层 陶瓷和由导电材料制成的第二互连层，机械粘合层机械粘合树脂基板层和陶瓷基板层;以及电接合构件，其穿透机械接合层并电连接树脂基板层和 陶瓷基板层。

公开(公告)号：US20080192453A1

公开(公告)日：2008-08-14

申请号：US12099450

申请日：2008-04-08

申请人： Masateru Koide ,  Tomoyuki Abe

发明人： Masateru Koide ,  Tomoyuki Abe

IPC分类号： H05K1/14 ,  H05K3/36

CPC分类号： H05K3/4688 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/462 ,  H05K3/4641 ,  H05K2203/1189 ,  Y10T29/49126

摘要： According to an aspect of an embodiment, a multilayer interconnection substrate comprises a resin substrate layer comprising a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer comprising a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.

摘要翻译： 根据实施例的一个方面，多层互连基板包括树脂基板层，该树脂基板层包括由树脂制成的第一绝缘层和由导电材料制成的第一互连层，陶瓷基板层包括由 陶瓷和由导电材料制成的第二互连层，机械粘合层机械粘合树脂基板层和陶瓷基板层;以及电接合构件，其穿透机械接合层并电连接树脂基板层和 陶瓷基板层。

公开(公告)号：US08289728B2

公开(公告)日：2012-10-16

申请号：US12888013

申请日：2010-09-22

申请人： Masateru Koide

发明人： Masateru Koide

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/4608 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2924/00

摘要： An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate.

摘要翻译： 一种用于互连并布置在第一电路板和第二电路板之间的互连板，所述互连板包括第一导电板，所述第一导电板包括第一连接端子，第一绝缘构件，所述第一绝缘构件包围除所述第一连接端子之外的所述第一导电板， 包括第二连接端子的导电板，包围除了第二连接端子之外的第二导电板的第二绝缘构件，布置在第一绝缘构件和第二绝缘构件之间的绝缘基板，以及贯穿第一绝缘构件的导电构件， 第二绝缘构件和绝缘基板。

公开(公告)号：US20110220398A1

公开(公告)日：2011-09-15

申请号：US13113305

申请日：2011-05-23

申请人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

发明人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

IPC分类号： H05K1/09 ,  H01L21/50 ,  B23K31/02

CPC分类号： H05K1/0271 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81411 ,  H01L2224/81805 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/01083

摘要： A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

摘要翻译： 一种制造包括第一和第二部件的电子设备的方法，包括：在第一部件和第二部件之一上形成第一焊料凸块; 在所述第一部件和所述第二部件中的另一个上形成第二焊料凸块; 使得第一焊料凸点在比第一和第二焊料凸块中的任何一个的液相线温度高的温度下与第二焊料凸块接触，使得第一和第二焊料凸块熔合在一起以形成合金的焊接接头 具有比第一和第二焊料凸块中的任一个更低的液相线温度; 并固化第一和第二部件之间的焊接接头。