发明授权
US5568252A Method and apparatus for measuring insulation film thickness of
semiconductor wafer
失效
用于测量半导体晶片的绝缘膜厚度的方法和装置
- 专利标题: Method and apparatus for measuring insulation film thickness of semiconductor wafer
- 专利标题(中): 用于测量半导体晶片的绝缘膜厚度的方法和装置
-
申请号: US363535申请日: 1994-12-23
-
公开(公告)号: US5568252A公开(公告)日: 1996-10-22
- 发明人: Tatsufumi Kusuda , Motohiro Kouno , Ikuyoshi Nakatani , Sadao Hirae
- 申请人: Tatsufumi Kusuda , Motohiro Kouno , Ikuyoshi Nakatani , Sadao Hirae
- 申请人地址: JPX
- 专利权人: Dainippon Screen Manufacturing Co., Ltd.
- 当前专利权人: Dainippon Screen Manufacturing Co., Ltd.
- 当前专利权人地址: JPX
- 优先权: JPX5-350500 19931228
- 主分类号: G01B11/06
- IPC分类号: G01B11/06 ; H01L21/66 ; G01N21/00
摘要:
Reflectance measurement with two monochromatic light beams having different wavelengths is used to obtain curves respective representing the relationship between an insulation film thickness of a semiconductor wafer and the gap between a test electrode and a semiconductor wafer surface. The C-V curve measurement at a fixed gap determines a total capacity of the gap and the insulation film, and a straight line representing the relationship between the gap and the insulation film thickness is obtained from the total capacity. An intersection where the two curves and the straight line cross gives the true values of the gap and the insulation film thickness. Other possible methods include: one for executing the C-V curve measurement and the reflectance measurement with two linear polarized light beams having identical wavelengths but different polarization directions; one for executing the reflectance measurement with three monochromatic light beams that differ in at least wavelength and/or polarization direction; and one for executing the reflectance measurement and the C-V curve measurement for two different gaps.
公开/授权文献
信息查询