发明授权
- 专利标题: Polyamide resin composition
- 专利标题(中): 聚酰胺树脂组合物
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申请号: US257563申请日: 1994-06-10
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公开(公告)号: US5583177A公开(公告)日: 1996-12-10
- 发明人: Koji Kinoshita , Nori Yoshihara , Minoru Hayashi , Kiyotaka Nakai
- 申请人: Koji Kinoshita , Nori Yoshihara , Minoru Hayashi , Kiyotaka Nakai
- 申请人地址: JPX Osaka JPX Kariya
- 专利权人: Toyo Boseki Kabushiki Kaisha,Aisin Seiki Kabushiki Kaisha
- 当前专利权人: Toyo Boseki Kabushiki Kaisha,Aisin Seiki Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka JPX Kariya
- 优先权: JPX5-140782 19930611
- 主分类号: C08K3/00
- IPC分类号: C08K3/00 ; C08K3/22 ; C08L23/02 ; C08L25/08 ; C08L25/10 ; C08L77/00 ; C08L83/02
摘要:
There is disclosed a polyamide resin composition containing: (A) 85 to 95 parts by weight of a polyamide resin; (B) 5 to 15 parts by weight of wollastonite; (C) 3 to 10 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a styrene copolymer modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides; and (D) 0.5 to 5 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a high-density polyethylene modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides, the high-density polyethylene having a weight-average molecular weight of 50,000 to 400,000.
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