RESIN COMPOSITION AND ARTICLE MADE THEREFROM

    公开(公告)号:US20210130610A1

    公开(公告)日:2021-05-06

    申请号:US16713918

    申请日:2019-12-13

    发明人: Chen-Yu HSIEH

    摘要: A resin composition includes a vinyl-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination type ionic compound with a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.