发明授权
- 专利标题： Processed substrate obtained by a process for effecting suppression of electrification
- 专利标题（中）： 通过抑制电气化的方法获得的加工底物
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申请号： US456313申请日： 1995-06-01
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公开(公告)号： US5589270A公开(公告)日： 1996-12-31
- 发明人: Fumio Murai , Yasunori Suzuki , Hideki Tomozawa , Ryuma Takashi , Yoshihiro Saida , Yoshiaki Ikenoue
- 申请人： Fumio Murai , Yasunori Suzuki , Hideki Tomozawa , Ryuma Takashi , Yoshihiro Saida , Yoshiaki Ikenoue
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Showa Denko K.K.
- 当前专利权人： Hitachi, Ltd.,Showa Denko K.K.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX2-138467 19900530
- 主分类号： G21K5/04
- IPC分类号： G21K5/04 ; C09D5/24 ; G03F7/038 ; G03F7/09 ; G03F7/11 ; G03F7/20 ; H01J37/305 ; H01J37/317 ; H01L21/027 ; H01L21/265 ; H01L21/266 ; H01L21/66 ; B32B9/04
摘要：
Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.
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