发明授权
- 专利标题: Method of producing thick multi-layer substrates
- 专利标题(中): 生产厚多层基板的方法
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申请号: US599112申请日: 1996-02-09
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公开(公告)号: US5593722A公开(公告)日: 1997-01-14
- 发明人: Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
- 申请人: Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
- 申请人地址: JPX Kariya
- 专利权人: Nippondenso Co., Ltd.
- 当前专利权人: Nippondenso Co., Ltd.
- 当前专利权人地址: JPX Kariya
- 优先权: JPX4-342802 19921222; JPX4-342803 19921222
- 主分类号: H01C17/242
- IPC分类号: H01C17/242 ; H01C17/30 ; H01L21/70 ; H05K1/09 ; H05K1/16 ; H05K3/46 ; B05D5/12
摘要:
A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.
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