发明授权
- 专利标题： Method for etching through a substrate to an attached coating
- 专利标题（中）： 通过基板蚀刻到附着涂层的方法
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申请号： US367641申请日： 1995-01-03
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公开(公告)号： US5603848A公开(公告)日： 1997-02-18
- 发明人: Howard R. Beratan , James F. Belcher , Scott R. Summerfelt
- 申请人： Howard R. Beratan , James F. Belcher , Scott R. Summerfelt
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： C23F1/02
- IPC分类号： C23F1/02 ; G01J5/20 ; H01L37/02 ; B44C1/22 ; C03C19/00 ; C03C25/06 ; C23F1/00
摘要：
An etching process is provided using electromagnetic radiation and a selected etchant (52) to selectively remove various types of materials (53) from a substrate (48). Contacts (49, 56, 64) may be formed to shield the masked regions (51) of the substrate (48) having an attached coating (20) during irradiation of the unmasked regions (53) of the substrate (48). The unmasked regions (53) are then exposed to an etchant (52) and irradiated to substantially increase their reactivity with the etchant (52) such that the etchant (52) etches the unmasked regions (53) substantially faster than the masked regions (51) and the contacts (49, 56, 64).