发明授权
US5612244A Insulated gate semiconductor device having a cavity under a portion of a
gate structure and method of manufacture
失效
绝缘栅半导体器件具有在栅极结构的一部分下方的空腔和制造方法
- 专利标题: Insulated gate semiconductor device having a cavity under a portion of a gate structure and method of manufacture
- 专利标题(中): 绝缘栅半导体器件具有在栅极结构的一部分下方的空腔和制造方法
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申请号: US408657申请日: 1995-03-21
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公开(公告)号: US5612244A公开(公告)日: 1997-03-18
- 发明人: Robert B. Davies , Andreas A. Wild
- 申请人: Robert B. Davies , Andreas A. Wild
- 申请人地址: IL Schaumburg
- 专利权人: Motorola, Inc.
- 当前专利权人: Motorola, Inc.
- 当前专利权人地址: IL Schaumburg
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/336 ; H01L21/8238 ; H01L29/423 ; H01L21/265 ; H01L21/70 ; H01L27/00
摘要:
An insulated gate field effect transistor (10) having an reduced gate to drain capacitance and a method of manufacturing the field effect transistor (10). A dopant well (13) is formed in a semiconductor substrate (11). A gate oxide layer (26) is formed on the dopant well (13) wherein the gate oxide layer (26) and a gate structure (41) having a gate contact portion (43) and a gate extension portion (44). The gate contact portion (43) permits electrical contact to the gate structure (41), whereas the gate extension portion (44) serves as the active gate portion. A portion of the gate oxide (26) adjacent the gate contact portion (43) is thickened to lower a gate to drain capacitance of the field effect transistor (10) and thereby increase a bandwidth of the insulated gate field effect transistor (10).
公开/授权文献
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