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US5612244A Insulated gate semiconductor device having a cavity under a portion of a gate structure and method of manufacture 失效
绝缘栅半导体器件具有在栅极结构的一部分下方的空腔和制造方法

Insulated gate semiconductor device having a cavity under a portion of a
gate structure and method of manufacture
摘要:
An insulated gate field effect transistor (10) having an reduced gate to drain capacitance and a method of manufacturing the field effect transistor (10). A dopant well (13) is formed in a semiconductor substrate (11). A gate oxide layer (26) is formed on the dopant well (13) wherein the gate oxide layer (26) and a gate structure (41) having a gate contact portion (43) and a gate extension portion (44). The gate contact portion (43) permits electrical contact to the gate structure (41), whereas the gate extension portion (44) serves as the active gate portion. A portion of the gate oxide (26) adjacent the gate contact portion (43) is thickened to lower a gate to drain capacitance of the field effect transistor (10) and thereby increase a bandwidth of the insulated gate field effect transistor (10).
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