发明授权
US5635754A Radiation shielding of integrated circuits and multi-chip modules in
ceramic and metal packages
失效
陶瓷和金属封装中的集成电路和多芯片模块的辐射屏蔽
- 专利标题： Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
- 专利标题（中）： 陶瓷和金属封装中的集成电路和多芯片模块的辐射屏蔽
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申请号： US372289申请日： 1995-01-13
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公开(公告)号： US5635754A公开(公告)日： 1997-06-03
- 发明人: David J. Strobel , David R. Czajkowski
- 申请人： David J. Strobel , David R. Czajkowski
- 申请人地址： CA San Diego
- 专利权人： Space Electronics, Inc.
- 当前专利权人： Space Electronics, Inc.
- 当前专利权人地址： CA San Diego
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L23/00 ; H01L23/02 ; H01L23/04 ; H01L23/055 ; H01L23/057 ; H01L23/06 ; H01L23/08 ; H01L23/18 ; H01L23/552 ; H01L25/04 ; H01L25/065 ; H01L23/043
摘要：
The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.
公开/授权文献
- US5493129A Thin film transistor structure having increased on-current 公开/授权日：1996-02-20
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