发明授权
- 专利标题： Method of manufacture of an interconnect stress test coupon
- 专利标题（中）： 互连应力试样的制造方法
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申请号： US442938申请日： 1995-05-17
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公开(公告)号： US5701667A公开(公告)日： 1997-12-30
- 发明人: Stephen Michael Birch , Gerard Michel Gavrel , Zaffar Iqbal Memon
- 申请人： Stephen Michael Birch , Gerard Michel Gavrel , Zaffar Iqbal Memon
- 申请人地址： MA Maynard
- 专利权人： Digital Equipment Corporation
- 当前专利权人： Digital Equipment Corporation
- 当前专利权人地址： MA Maynard
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; H05K1/02 ; H05K3/42 ; H01K3/10
摘要：
This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet which is used for mounting the test coupon as well as housing a number of the other components that make up the system. During a pre-cycling phase, the system determines the correct current that should be passed through the coupon in order to heat it to a predetermined temperature. After that test current value is determined the system actually stress tests the coupon by passing the determined test current through the coupon. It does so for a selected number of cycles, and monitors resistance changes in the coupon during testing while recording test data. This disclosure also describes the test coupon, which is designed to uniformly dissipate the heat created during stress cycling.
公开/授权文献
- US4488177A T.V. Integrator circuit and horizontal oscillator 公开/授权日：1984-12-11
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