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公开(公告)号:US5701667A
公开(公告)日:1997-12-30
申请号:US442938
申请日:1995-05-17
CPC分类号: H05K1/0212 , G01R31/2805 , G01R31/2817 , G01R31/2818 , H05K1/0201 , H05K1/0266 , H05K1/0268 , H05K2201/09609 , H05K2201/09627 , H05K2201/10151 , H05K2203/1115 , H05K2203/1194 , H05K2203/162 , H05K3/429 , Y10T29/49165
摘要: This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet which is used for mounting the test coupon as well as housing a number of the other components that make up the system. During a pre-cycling phase, the system determines the correct current that should be passed through the coupon in order to heat it to a predetermined temperature. After that test current value is determined the system actually stress tests the coupon by passing the determined test current through the coupon. It does so for a selected number of cycles, and monitors resistance changes in the coupon during testing while recording test data. This disclosure also describes the test coupon, which is designed to uniformly dissipate the heat created during stress cycling.
摘要翻译: 本公开描述了与IST系统一起使用的互连压力测试(IST)系统和印刷线路板测试券。 该系统包括一个计算机设备和一个柜子,用于安装测试件以及容纳构成系统的其他组件。 在预循环阶段期间,系统确定应该通过试样的正确电流,以将其加热到预定温度。 在该测试之后,确定当前值,系统实际上通过将确定的测试电流通过优惠券来测试优惠券。 它在选定的周期内执行此操作,并在记录测试数据的同时监测测试期间优惠券的电阻变化。 本公开还描述了测试试样,其被设计成均匀地消散在应力循环期间产生的热量。