发明授权
- 专利标题： Surface acoustic wave device
- 专利标题（中）： 表面声波装置
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申请号： US495895申请日： 1995-06-28
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公开(公告)号： US5712523A公开(公告)日： 1998-01-27
- 发明人: Koji Nakashima , Hideya Morishita
- 申请人： Koji Nakashima , Hideya Morishita
- 申请人地址： JPX Kyoto-fu
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JPX Kyoto-fu
- 优先权： JPX7-002829 19950111
- 主分类号： H03H3/10
- IPC分类号： H03H3/10 ; H03H9/02 ; H03H9/08 ; H03H9/25 ; H01L41/08
摘要：
A SAW device (11) includes a SAW element (13) which is bonded onto a support substrate (12) in a face down mode through solder (19, 20), and a metal cap (21) enclosing the SAW element (13). Assuming that and .alpha..sub.1, .alpha..sub.2 and .alpha..sub.3 represent the thermal expansion coefficients of the SAW element (13), the support substrate (12) and the conductive cap (21) along the surface wave propagation direction respectively, .alpha..sub.3 .ltoreq..alpha..sub.1 when .alpha..sub.1 >.alpha..sub.2, and .alpha..sub.3 .ltoreq..alpha..sub.1 when .alpha..sub.1
公开/授权文献
- US4616209A "Keep warm" control 公开/授权日：1986-10-07
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