发明授权
- 专利标题： Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
- 专利标题（中）： 半导体封装环氧树脂组合物和封装的半导体器件
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申请号： US615145申请日： 1996-03-14
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公开(公告)号： US5739187A公开(公告)日： 1998-04-14
- 发明人: Eiichi Asano , Takayuki Aoki , Toshio Shiobara , Peter Flury , Wolfgang Scharf , Tadashi Okada
- 申请人： Eiichi Asano , Takayuki Aoki , Toshio Shiobara , Peter Flury , Wolfgang Scharf , Tadashi Okada
- 申请人地址： JPX Tokyo NY Tarrytown
- 专利权人： Shin-Etsu Chemical Co., Ltd.,Ciba-Geigy Corporation
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.,Ciba-Geigy Corporation
- 当前专利权人地址： JPX Tokyo NY Tarrytown
- 优先权： JPX7-109059 19950410
- 主分类号： C08G59/30
- IPC分类号： C08G59/30 ; C08G59/32 ; C08K5/00 ; C08K5/523 ; C08L63/00 ; H01L23/29 ; C08G59/68 ; C08G65/10
摘要：
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.
公开/授权文献
- US4560151A Transmission mounting stand 公开/授权日：1985-12-24