发明授权
- 专利标题: Method of fabricating an epitaxial wafer
- 专利标题(中): 制造外延晶片的方法
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申请号: US806310申请日: 1997-02-26
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公开(公告)号: US5744380A公开(公告)日: 1998-04-28
- 发明人: Noriyuki Uemura , Hisami Motoura , Masashi Nishimura , Mitsuo Kohno
- 申请人: Noriyuki Uemura , Hisami Motoura , Masashi Nishimura , Mitsuo Kohno
- 申请人地址: JPX Kanagawa-ken
- 专利权人: Komatsu Electronic Metals Co., Ltd.
- 当前专利权人: Komatsu Electronic Metals Co., Ltd.
- 当前专利权人地址: JPX Kanagawa-ken
- 优先权: JPX5-231025 19930823
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; C23C14/08 ; C30B13/00 ; C30B15/00 ; C30B29/06 ; G01N21/88
摘要:
There is provided a high quality epitaxial water on which the density of microscopic defects in the epitaxial layer is reduced to keep the GOI thereof sufficiently high and to reduce a leakage current at the P-N junction thereof when devices are incorporated, to thereby improve the yield of such devices. In an epitaxial wafer obtained by forming an epitaxial layer on a substrate, the density of IR laser scatterers is 5.times.10.sup.5 pieces/cm.sup.3 or less throughout the epitaxial layer.
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