A micromechanical sensor has a plurality of sensing elements (14a-14d) which are supported at respective support regions (12a-12d). A first set of the sensing elements defines the sensing gap. In one arrangement this is defined by sensing elements supported by adjacent support regions. In another embodiment the sensing gap is defined between one sensing element and a reference beam formed by connection of the return legs of two diametrically opposed sensing elements. The sensing elements are substantially similar one to another and each sensing element comprises an outgoing elongate leg extending away from its associated support region and a return leg substantially parallel to the outgoing leg extending towards the support region. By providing sensing elements which are substantially similar in shape and arranged in this way, the effects of thin film stress are minimized.