发明授权
- 专利标题： Integrated circuit and process for its manufacture
- 专利标题（中）： 集成电路及其制造工艺
-
申请号： US739133申请日： 1996-10-28
-
公开(公告)号： US5767014A公开(公告)日： 1998-06-16
- 发明人: Craig Jon Hawker , James Lupton Hedrick , Robert Dennis Miller
- 申请人： Craig Jon Hawker , James Lupton Hedrick , Robert Dennis Miller
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/3205
- IPC分类号： H01L21/3205 ; H01L21/312 ; H01L21/768 ; H01L23/522 ; H01L23/532 ; H01L21/28
摘要：
The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of a hyperbranched polymer and organic polysilica.
公开/授权文献
信息查询
IPC分类:
