发明授权
- 专利标题： Processing low dielectric constant materials for high speed electronics
- 专利标题（中）： 加工用于高速电子的低介电常数材料
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申请号： US561990申请日： 1995-11-22
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公开(公告)号： US5785787A公开(公告)日： 1998-07-28
- 发明人: Robert John Wojnarowski , Herbert Stanley Cole , Theresa Ann Sitnik-Nieters , Wolfgang Daum
- 申请人： Robert John Wojnarowski , Herbert Stanley Cole , Theresa Ann Sitnik-Nieters , Wolfgang Daum
- 申请人地址： NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： NY Schenectady
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/09 ; H05K3/38 ; B32B31/12 ; B32B31/14
摘要：
A method for fabricating a low dielectric constant printed circuit board includes dispersing an additive material in a low dielectric constant porous polymer layer; providing holes through the low dielectric constant porous polymer layer; applying a metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes; patterning the metallization layer; and removing the additive material from the low dielectric constant porous polymer layer. The removal of the additive material can be accomplished by sublimation, evaporation, and diffusion.
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