公开(公告)号：US06770885B2

公开(公告)日：2004-08-03

申请号：US09682389

申请日：2001-08-29

申请人： Jeffrey Wayne Eberhard ,  Herbert Stanley Cole ,  Robert Forrest Kwasnick ,  Theresa Ann Sitnik-Nieters

发明人： Jeffrey Wayne Eberhard ,  Herbert Stanley Cole ,  Robert Forrest Kwasnick ,  Theresa Ann Sitnik-Nieters

IPC分类号： G01T120

CPC分类号： G01T1/2002 ,  G01T1/1642 ,  G01T1/2018 ,  Y10T156/10

摘要： A radiation imaging system comprising a scintillator, an imager array, and a lamination layer. Lamination layer bonds and optically couples scintillator to imager array. Lamination layer is comprised of a lamination material that is substantially free from void spaces. Radiation imaging system fabrication comprises the steps of disposing lamination layer between a light imager and a scintillator to form a subassembly. Light imager comprises imager array, an imaging plate surface and a plurality of contact pads. Additional steps include subjecting subassembly to a vacuum; heating subassembly to a bonding temperature, exerting a bonding force on subassembly, maintaining the vacuum, the bonding temperature and the bonding force until light imager is bonded to the scintillator and the lamination layer is comprised of lamination material that is substantially free from void spaces.

摘要翻译： 一种包括闪烁体，成像器阵列和层叠层的辐射成像系统。 复合层结合并将闪烁体光学耦合到成像器阵列。 层压层由基本上没有空隙的层压材料组成。 辐射成像系统制造包括在光成像仪和闪烁体之间设置层压层以形成子组件的步骤。 光成像仪包括成像器阵列，成像板表面和多个接触焊盘。 附加步骤包括使组件进行真空; 加热组件到接合温度，在组件上施加接合力，保持真空，接合温度和接合力，直到光成像仪结合到闪烁体，并且层压层由基本上没有空隙的层压材料构成。

公开(公告)号：US06294741B1

公开(公告)日：2001-09-25

申请号：US08907441

申请日：1997-08-08

申请人： Herbert Stanley Cole, Jr. ,  Theresa Ann Sitnik-Nieters

发明人： Herbert Stanley Cole, Jr. ,  Theresa Ann Sitnik-Nieters

IPC分类号： H05K116

CPC分类号： H01L24/29 ,  H01L23/293 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10S428/901 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

摘要翻译： 提供了一种多芯片电子模块，其利用苯并环丁烯作为层压粘合剂，用于以高密度互连结构粘合上电介质膜。 将苯并环丁烯热固性聚合物旋涂在聚酰亚胺膜上，并在低温下烘烤以除去任何溶剂以在聚酰亚胺膜上留下B阶涂层。 复合膜可以使用真空层压机和热层压到下面的电气结构。 当施加热量时，BCB层软化，流动然后固化以将聚酰亚胺膜结合到下面的电气结构。

公开(公告)号：US06191681B1

公开(公告)日：2001-02-20

申请号：US08896874

申请日：1997-07-21

申请人： Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Anil Raj Duggal

发明人： Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Anil Raj Duggal

IPC分类号： H01C710

CPC分类号： H01C7/027 ,  Y10T29/49082

摘要： A current limiting device utilizes an electrically conductive composite material and an inhomogeneous distribution of resistance structure. The electrically conductive composite material comprises an organic binder portion comprising a high Tg epoxy and a low viscosity polyglycol epoxy; at least one epoxy curing agent; and a conductive powder.

摘要翻译： 限流装置利用导电复合材料和电阻结构的不均匀分布。 导电复合材料包括包含高Tg环氧树脂和低粘度聚乙二醇环氧树脂的有机粘合剂部分; 至少一种环氧固化剂; 和导电粉末。

公开(公告)号：US06362722B1

公开(公告)日：2002-03-26

申请号：US09709880

申请日：2000-11-13

申请人： Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Anil Raj Duggal

发明人： Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Anil Raj Duggal

IPC分类号： H01C710

CPC分类号： H01C7/027 ,  Y10T29/49082

摘要： A current limiting device utilizes an electrically conductive composite material and an inhomogeneous distribution of resistance structure. The electrically conductive composite material comprises an organic binder portion comprising a high Tg epoxy and a low viscosity polyglycol epoxy; at least one epoxy curing agent; and a conductive powder.

摘要翻译： 限流装置利用导电复合材料和电阻结构的不均匀分布。 导电复合材料包括包含高Tg环氧树脂和低粘度聚乙二醇环氧树脂的有机粘合剂部分; 至少一种环氧固化剂; 和导电粉末。

公开(公告)号：US06297459B1

公开(公告)日：2001-10-02

申请号：US09019304

申请日：1998-02-05

申请人： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

发明人： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

IPC分类号： H05K109

CPC分类号： H05K1/024 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A low dielectric constant printed circuit board includes: a low dielectric constant porous polymer layer having holes therethrough, the porous layer having pores; and a patterned metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes, the patterned metallization layer not significantly protruding into the pores of the porous layer.

摘要翻译： 低介电常数印刷电路板包括：具有穿过其中的孔的低介电常数多孔聚合物层，多孔层具有孔; 以及在低介电常数多孔聚合物层的表面和孔的表面上的图案化金属化层，图案化金属化层不会显着地突出到多孔层的孔中。

公开(公告)号：US5785787A

公开(公告)日：1998-07-28

申请号：US561990

申请日：1995-11-22

申请人： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

发明人： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  B32B31/12 ,  B32B31/14

CPC分类号： H05K1/024 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K3/386 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method for fabricating a low dielectric constant printed circuit board includes dispersing an additive material in a low dielectric constant porous polymer layer; providing holes through the low dielectric constant porous polymer layer; applying a metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes; patterning the metallization layer; and removing the additive material from the low dielectric constant porous polymer layer. The removal of the additive material can be accomplished by sublimation, evaporation, and diffusion.

摘要翻译： 一种制造低介电常数印刷电路板的方法，包括将添加剂材料分散在低介电常数多孔聚合物层中; 通过低介电常数多孔聚合物层提供孔; 在低介电常数多孔聚合物层的表面和孔的表面上施加金属化层; 图案化金属化层; 并从低介电常数多孔聚合物层中除去添加剂材料。 添加剂的去除可以通过升华，蒸发和扩散来实现。

公开(公告)号：US5745984A

公开(公告)日：1998-05-05

申请号：US500671

申请日：1995-07-10

申请人： Herbert Stanley Cole, Jr. ,  Theresa Ann Sitnik-Nieters

发明人： Herbert Stanley Cole, Jr. ,  Theresa Ann Sitnik-Nieters

IPC分类号： H01L21/58 ,  H01L21/98 ,  H01L23/29 ,  H01L23/538 ,  H05K3/38 ,  H05K3/46 ,  H05K3/32

CPC分类号： H01L24/29 ,  H01L23/293 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L25/50 ,  H05K3/4655 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T29/49165

摘要： A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

摘要翻译： 提供了一种多芯片模块，其利用苯并环丁烯作为用于以高密度互连结构粘合上电介质膜的层压粘合剂。 将苯并环丁烯热固性聚合物旋涂在聚酰亚胺膜上，并在低温下烘烤以除去任何溶剂以在聚酰亚胺膜上留下B阶涂层。 复合膜可以使用真空层压机和热层压到下面的电气结构。 当施加热量时，BCB层软化，流动然后固化以将聚酰亚胺膜结合到下面的电气结构。