公开(公告)号：US07572973B2

公开(公告)日：2009-08-11

申请号：US12328788

申请日：2008-12-05

申请人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

发明人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

IPC分类号： H01L35/34 ,  H02N10/00

CPC分类号： H01L35/32 ,  Y10T156/1092

摘要： A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

摘要翻译： 制造固态热转印装置的方法包括彼此相对定位的第一和第二导电基板。 固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电 底物。

公开(公告)号：US20090031733A1

公开(公告)日：2009-02-05

申请号：US11830890

申请日：2007-07-31

申请人： Stanton Earl Weaver, JR. ,  Mehmet Arik ,  James William Bray ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Mark Wayne Wilson ,  Jason Knud Klindtworth ,  Surajit Atha

发明人： Stanton Earl Weaver, JR. ,  Mehmet Arik ,  James William Bray ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Mark Wayne Wilson ,  Jason Knud Klindtworth ,  Surajit Atha

IPC分类号： F25B21/02

CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66

摘要： A refrigeration system is provided. The refrigeration system includes at least one thermal blocking thermotunneling device. The thermal blocking thermotunneling device comprises a first and a second surface separated by a nanoscale gap of less than about 20 nm, such that tunneling of electrons causes a unidirectional transfer of heat from the first surface to the second surface. Further, the at least one thermal blocking thermotunneling device has a thermal back path of less than about 70 percent.

摘要翻译： 提供制冷系统。 制冷系统包括至少一个热阻热电火花钻孔装置。 热阻焊热电火焰装置包括由小于约20nm的纳米尺度间隙分开的第一和第二表面，使得电子的隧穿导致热量从第一表面到第二表面的单向转移。 此外，所述至少一个热阻焊热电火花钻孔装置具有小于约70％的热回路径。

公开(公告)号：US06412971B1

公开(公告)日：2002-07-02

申请号：US09258935

申请日：1999-03-01

申请人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  William Paul Kornrumpf

发明人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  William Paul Kornrumpf

IPC分类号： H01L3300

CPC分类号： H01L24/10 ,  F21K9/232 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L21/3043 ,  H01L21/76898 ,  H01L21/78 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/05599

摘要： A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electrical connections, each electrical connection coupled for providing electrical power to a respective LESD. The LESDs are arranged on the substrate with sufficient density and light generating capability to provide a predetermined irradiation from the light source.

摘要翻译： 光源包括基板; 一组未封装的发光半导体器件（LESD），每个LESD具有至少一个用于发光的表面和一个衬底表面附着于衬底; 以及多个电连接，每个电连接用于向相应的LESD提供电力。 LESD被布置在具有足够的密度和光产生能力的基板上，以提供来自光源的预定辐射。

公开(公告)号：US06410356B1

公开(公告)日：2002-06-25

申请号：US09520751

申请日：2000-03-07

申请人： Robert John Wojnarowski ,  Ernest Wayne Balch ,  Leonard Richard Douglas

发明人： Robert John Wojnarowski ,  Ernest Wayne Balch ,  Leonard Richard Douglas

IPC分类号： H01L2166

CPC分类号： H01L22/20 ,  H01L23/34 ,  H01L2224/92144 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/00

摘要： A method for interconnecting high-temperature silicon carbide (SiC) devices enables such high-temperature devices to be used in fabricating electronic circuits of significant scale. This method comprises empirically measuring operational characteristics of a plurality of the devices to be interconnected, the operational characteristics comprising devices which are measured to be non-working and devices which are measured to be working; characterizing the operational characteristics in an operational characteristics map; designing interconnection paths between and among the devices that are characterized to be working by the operational characteristics map; and excluding from the interconnection paths, devices that are characterized to be non-working by the operational characteristics map. A preferred embodiment of this method further includes disposing a temporary polymer layer over the devices; forming via holes through the temporary polymer layer, to bonding pads of the devices; applying a current-balancing resistive metal over the temporary polymer layer; establishing connections between the current-balancing resistive metal and the bonding pads; designing the interconnection paths between and among the working devices by patterning the current-balancing resistive metal based on the operational characteristics map; and removing the temporary polymer layer.

摘要翻译： 用于互连高温碳化硅（SiC）器件的方法使得这种高温器件能够用于制造具有显着规模的电子电路。 该方法包括经验地测量待互连的多个设备的操作特性，操作特性包括被测量为不工作的设备和被测量为工作的设备; 表征操作特征图中的操作特性; 设计特征在于通过操作特征图工作的设备之间的互连路径; 并且从互连路径中排除特征在于通过操作特性图不工作的设备。 该方法的优选实施例还包括在器件上设置临时聚合物层; 通过所述临时聚合物层形成通孔到所述装置的焊盘; 在临时聚合物层上施加电流平衡电阻金属; 建立电流平衡电阻金属和焊盘之间的连接; 通过基于操作特性图构图电流平衡电阻金属来设计工作装置之间和之间的互连路径; 并除去临时聚合物层。

公开(公告)号：US06302987B1

公开(公告)日：2001-10-16

申请号：US09286329

申请日：1999-04-05

申请人： Robert John Wojnarowski ,  Clive William Reed ,  Thomas Bert Gorczyca

发明人： Robert John Wojnarowski ,  Clive William Reed ,  Thomas Bert Gorczyca

IPC分类号： B29C6552

CPC分类号： H02G5/005 ,  Y10T29/49945

摘要： A method for coupling electrically conductive bushings in a bus, including alternating layers of dielectric material and patterned, electrically conductive bus bars and having through holes therein with each through hole having a surface exposing a portion of a respective one of the bus bars, includes: applying a polymer mixture to the surface of each through hole; inserting the bushings in the respective through holes; and curing the polymer mixture by positioning the bus and bushings in a curing chamber, applying a vacuum to the curing chamber, and applying pressure to reduce voids in the polymer mixture and minimize further void formation.

摘要翻译： 一种用于在总线中耦合导电衬套的方法，包括介电材料和图案化的导电母线的交替层，并且在其中具有通孔，每个通孔具有露出相应一个母线的一部分的表面的方法包括： 将聚合物混合物施加到每个通孔的表面; 将衬套插入相应的通孔中; 并通过将母线和套管定位在固化室中，对固化室施加真空并施加压力以减小聚合物混合物中的空隙并使进一步的空隙形成最小化来固化聚合物混合物。

公开(公告)号：US5866952A

公开(公告)日：1999-02-02

申请号：US565269

申请日：1995-11-30

申请人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

发明人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

IPC分类号： H01L25/18 ,  H01L21/98 ,  H01L23/538 ,  H01L25/04 ,  H01L23/29

CPC分类号： H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/295 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/75 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.

摘要翻译： 高密度互连多芯片模块在模制聚合物基片周围的芯片之前设置有围绕芯片布置的减小应力的材料。 具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。 围绕芯片沉积顺应性材料，然后将模具形式定位在芯片周围。 在模具形式中加入聚合物基材模塑材料，然后将基材模塑材料硬化。 具有与预定接触焊盘对准的通路并具有穿过通孔延伸的电导体的通孔的电介质层位于硬化的基板模制材料和芯片的表面上。 在添加基底模制材料之前，可以将热塞固定到芯片的背面。

公开(公告)号：US07667375B2

公开(公告)日：2010-02-23

申请号：US11398840

申请日：2006-04-06

申请人： Ertugrul Berkcan ,  Robert John Wojnarowski ,  Emad Andarawis Andarawis ,  Samantha Rao ,  Eladio Delgado

发明人： Ertugrul Berkcan ,  Robert John Wojnarowski ,  Emad Andarawis Andarawis ,  Samantha Rao ,  Eladio Delgado

IPC分类号： H01L41/08 ,  H01L41/083

CPC分类号： H01L41/1136 ,  H02N2/188

摘要： A broad band energy harvesting system to harvest energy from a structure and associated methods are provided. The system includes a structure carrying a plurality of environmentally produced vibration frequencies extending over a frequency range and an energy harvesting apparatus positioned in vibration receiving communication with the structure to harvest energy from the structure. Each energy harvesting apparatus includes broadly tuned energy harvesting generators having relatively low quality factor and corresponding relatively wide bandwidth. The energy harvesting generators collectively provide energy harvesting over multiple modes to thereby provide energy harvesting over a substantial portion of the frequency range. Each energy harvesting generator can include a cantilevered beam connected to a common backbone comprised of a resilient material configured to transfer energy between adjacent generators to further enhance energy harvesting.

摘要翻译： 提供了一种从结构和相关方法收集能量的宽带能量收集系统。 该系统包括承载在频率范围上延伸的多个环境产生的振动频率的结构，以及定位在振动中的能量收集装置，该振动接收与结构的通信以从结构收集能量。 每个能量收集装置包括具有相对较低质量因素和相应较宽带宽的广泛调谐的能量采集发生器。 能量收集发电机在多种模式下共同提供能量收集，从而在频率范围的大部分内提供能量收集。 每个能量收集发生器可以包括连接到公共骨架的悬臂梁，弹性材料构造成在相邻发电机之间传递能量以进一步增强能量收集。

公开(公告)号：US07527742B2

公开(公告)日：2009-05-05

申请号：US11167719

申请日：2005-06-27

申请人： Steven Alfred Tysoe ,  Steven Francis LeBoeuf ,  Mark Philip D'Evelyn ,  Venkat Subramaniam Venkataramani ,  Vinayak Tilak ,  Jeffrey Bernard Fortin ,  Charles Adrian Becker ,  Stephen Daley Arthur ,  Samhita Dasgupta ,  Kanakasabapathi Subramanian ,  Robert John Wojnarowski ,  Abasifreke Udo Ebong

发明人： Steven Alfred Tysoe ,  Steven Francis LeBoeuf ,  Mark Philip D'Evelyn ,  Venkat Subramaniam Venkataramani ,  Vinayak Tilak ,  Jeffrey Bernard Fortin ,  Charles Adrian Becker ,  Stephen Daley Arthur ,  Samhita Dasgupta ,  Kanakasabapathi Subramanian ,  Robert John Wojnarowski ,  Abasifreke Udo Ebong

IPC分类号： C03C15/00 ,  C03C25/68

CPC分类号： H01L21/31111

摘要： An etchant including a halogenated salt, such as Cryolite (Na3AlF6) or potassium tetrafluoro borate (KBF4), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (Na3AlF6), potassium tetrafluoro borate (KBF4), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

摘要翻译： 提供包括卤化盐的蚀刻剂，例如冰晶石（Na 3 AlF 6）或四氟硼酸钾（KBF 4）。 盐可以以足以蚀刻基材的量存在于蚀刻剂中，并且可以具有大于约200摄氏度的熔体温度。 湿蚀刻的方法可以包括使蚀刻剂与多层层压体的支撑层的至少一个表面接触，其中所述支撑层可以包括氧化铝; 或使蚀刻剂与多层层压体的支撑层的至少一个表面接触，其中所述蚀刻剂可以包括冰晶石（Na 3 AlF 6），四氟硼酸钾（KBF 4）或两者; 并蚀刻所述支撑层的至少一部分。 该方法可以提供通过将结晶生长到氧化铝载体层上并通过湿蚀刻化学去除至少一部分载体层而制备的层压体。 提供了包括层压板的电子设备，光学设备或组合设备。

公开(公告)号：US06655011B1

公开(公告)日：2003-12-02

申请号：US09677718

申请日：2000-10-02

申请人： William Paul Kornrumpf ,  Robert John Wojnarowski

发明人： William Paul Kornrumpf ,  Robert John Wojnarowski

IPC分类号： H01H1100

CPC分类号： H01H1/0036 ,  H01H61/0107 ,  H01H2001/0042 ,  H01H2001/0073 ,  H01H2001/0084 ,  H01H2061/006 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.

摘要翻译： 具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为 在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。 该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。

公开(公告)号：US06092280A

公开(公告)日：2000-07-25

申请号：US318952

申请日：1999-05-26

申请人： Robert John Wojnarowski

发明人： Robert John Wojnarowski

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/32 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00 ,  H01L23/40

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917

摘要： A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

摘要翻译： 柔性膜界面包括柔性膜; 柔性材料附着在柔性膜的一部分上; 在柔性材料上的表面金属化，所述柔性膜具有至少一个通过其延伸到表面金属化的通孔; 以及浮动焊盘结构，其包括在所述柔性材料和所述表面金属化之上图案化的浮动焊盘金属化，所述浮动焊盘金属化的第一部分形成中心焊盘，并且所述浮动焊盘金属化的第二部分形成从所述中心焊盘的至少一个延伸部， 延伸到所述至少一个通孔中。