- 专利标题: Method and device of testing semiconductor integrated circuit chip capable of preventing electron-hole pairs
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申请号: US653834申请日: 1996-05-28
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公开(公告)号: US5815002A公开(公告)日: 1998-09-29
- 发明人: Kiyoshi Nikawa
- 申请人: Kiyoshi Nikawa
- 申请人地址: JPX Tokyo
- 专利权人: NEC Corporation
- 当前专利权人: NEC Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX7-128049 19950526
- 主分类号: G01R31/26
- IPC分类号: G01R31/26 ; G01R31/02 ; G01R31/302 ; G01R31/303 ; H01L21/66
摘要:
A supersonic wave beam producing device projects a supersonic wave beam 5 on a semiconductor integrated circuit chip 2 while a voltage is supplied to a semiconductor integrated circuit in the chip from a constant voltage source 1. A current detecting device 7 detects a change of a current in the circuit while the chip is supplied with the supersonic wave beam. In this event, the constant voltage source may be omitted. A supersonic wave beam producing device may project a supersonic wave beam 5 on a semiconductor integrated circuit chip 2 while a current is supplied to a semiconductor integrated circuit. In this event, a voltage detecting device detects a change of a voltage between two ones of terminals of the circuit.
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