公开(公告)号：US20230408578A1

公开(公告)日：2023-12-21

申请号：US17843942

申请日：2022-06-17

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： LAN-CHOU CHO ,  CHEWN-PU JOU ,  STEFAN RUSU

IPC分类号： G01R31/303 ,  G02B6/34 ,  G01R31/28

CPC分类号： G01R31/303 ,  G02B6/34 ,  G01R31/2884

摘要： A benchmark device and a method for evaluating a semiconductor wafer are provided. The benchmark device includes a first grating coupler, a second grating coupler and a waveguide. The waveguide has a least one bending section and is arranged in communication with the first grating coupler and the second grating coupler. The bending section comprises a first region having a first width and a first height, and a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.

公开(公告)号：US20220254691A1

公开(公告)日：2022-08-11

申请号：US17648457

申请日：2022-01-20

申请人： CHANGXIN MEMORY TECHNOLOGIES, INC.

发明人： Yuanjie XU

IPC分类号： H01L21/66 ,  H01L23/00 ,  G01R31/52 ,  G01R31/303

摘要： A fault isolation analysis method includes: providing a package structure in which there is an electrical fault; detecting whether the electrical fault is in interconnecting wires, and if the electrical fault is in the interconnecting wires, determining that the electrical fault is caused by the interconnecting wire; and if the electrical fault is not in the interconnecting wires, breaking the interconnecting wires to electrically isolate the chip structure from the substrate, then detecting whether the electrical fault is in the structure, and if the electrical fault is able to be detected, determining that the electrical fault is caused by the substrate, or if the electrical fault is not able to be detected, determining that the electrical fault is caused by the chip structure.

公开(公告)号：US10473587B2

公开(公告)日：2019-11-12

申请号：US15598844

申请日：2017-05-18

申请人： OHIO STATE INNOVATION FOUNDATION

发明人： Kubilay Sertel ,  Georgios C. Trichopoulos ,  Cosan Caglayan

IPC分类号： G01R31/302 ,  G01N21/3581 ,  G01R31/28 ,  H04L25/02 ,  G01R1/067 ,  H01P5/10 ,  H01Q25/02 ,  H01Q1/36 ,  H01Q15/23 ,  H01Q19/06 ,  H01Q19/13 ,  G01R31/303 ,  G01R31/311 ,  H04L25/08 ,  H01P3/00

摘要： Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair. A THz or mmW transmitter radiates a probe THz or mmW beam to the first differential antenna pair, and an electronic analyzer receives a THz or mmW signal radiated by the second differential antenna pair responsive to the radiation of the probe THz or mmW beam to the first differential antenna pair, thus enabling no-contact S-parameter measurements for characterizing differential-mode, on-wafer, active or passive devices and integrated circuits.

公开(公告)号：US20190310314A1

公开(公告)日：2019-10-10

申请号：US16359954

申请日：2019-03-20

申请人： MEDIATEK INC.

发明人： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC分类号： G01R31/302 ,  H01Q1/22 ,  G01R31/303 ,  G01R31/28

摘要： A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US10401424B2

公开(公告)日：2019-09-03

申请号：US15576144

申请日：2016-04-06

申请人： HITACHI, LTD.

发明人： Takumi Uezono ,  Tadanobu Toba ,  Kenichi Shimbo ,  Fumihiko Nagasaki

IPC分类号： G01R31/28 ,  G01R31/26 ,  G01R31/265 ,  G01R31/303 ,  G01R31/3181

摘要： Neutron soft error rate derivation is calculated from data at the low energy neutron radiation. An outline value of an SEU cross-section function corresponding to a given neutron energy value is outputted. This outline value and the low energy neutron spectrum data are used to calculate an error count basic value of errors to occur over time. An error count actual measurement value over time is calculated from an error count during radiation of low energy neutrons and low energy neutron radiation time. The error count basic value and the error count actual measurement are used to calculate a proportionality coefficient of the SEU cross-section function. While holding a natural neutron spectrum, an error rate calculator outputs a neutron flux corresponding to a neutron energy value. The neutron soft error rate is calculated by an integration operation of multiplying the SEU cross-section function with the natural neuron spectrum.

公开(公告)号：US10107858B2

公开(公告)日：2018-10-23

申请号：US15156807

申请日：2016-05-17

申请人： The United States of America, as represented by the Secretary of the Navy

发明人： Matthew Gadlage ,  Adam Duncan

IPC分类号： G01R27/28 ,  G01R31/303 ,  G01R31/319 ,  G11C29/56 ,  G01R31/302 ,  G01R31/317 ,  G06F13/36 ,  G06F13/40 ,  G06F13/42 ,  G11C11/412 ,  G11C29/50

摘要： A highly flexible, compact, lightweight, and portable testing system for use with radiation testing activities. The testing system is coupled to a device under test (DUT), which can be positioned in such a way that the top of the die package is exposed to the direct ion beam during radiation testing. A variety of sensors, onboard memory systems, programmable interfaces, onboard control systems, data output devices, and different types of interfaces are also provided which provide an ability to perform testing procedures while having a maximum ability to orient the DUT and perform a wide variety of testing currently unavailable.

公开(公告)号：US10094874B1

公开(公告)日：2018-10-09

申请号：US15208931

申请日：2016-07-13

申请人： Sandia Corporation

发明人： Paiboon Tangyunyong ,  Edward I. Cole, Jr. ,  Guillermo M. Loubriel ,  Joshua Beutler

IPC分类号： G01R31/307 ,  G01R27/28 ,  G01R31/303 ,  G01R31/311

摘要： A visualization method for screening electronic devices is provided. In accordance with the disclosed method, a probe is applied to a grid of multiple points on the circuit, and an output produced by the circuit in response to the stimulus waveform is monitored for each of multiple grid points where the probe is applied. A power spectrum analysis (PSA) produces a power spectrum amplitude, in each of one or more frequency bins, on the monitored output for each of the multiple grid points. The PSA provides a respective pixel value for each of the multiple grid points. An image is displayed, in which image portions representing the multiple grid points are displayed with the respective pixel values.

公开(公告)号：US09863976B2

公开(公告)日：2018-01-09

申请号：US14880174

申请日：2015-10-09

申请人： Keyssa Systems, Inc.

发明人： Bhupendra Sakerlal Sarhad ,  Christopher Scott Sansom

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R31/319 ,  G01R31/04 ,  G01R31/303

CPC分类号： G01R1/045 ,  G01R31/045 ,  G01R31/2822 ,  G01R31/303 ,  G01R31/31905

摘要： A test system includes a test socket assembly for capturing low energy electromagnetic emissions from radio frequency (RF) integrated circuits (ICs). The test socket assembly is structured to direct electromagnetic radiation from the device under test (DUT) to a socket port coupled to one end of a waveguide for transmission to a tester. The combination of the materials comprising the socket assembly is selected to more efficiently couple electromagnetic emissions from the DUT into the waveguide. For example, a reflective plane with an adjustable position may be located below the DUT in order to increase coupling of electromagnetic radiation from the DUT into the waveguide.

公开(公告)号：US09529040B2

公开(公告)日：2016-12-27

申请号：US14811549

申请日：2015-07-28

申请人： TECHINSIGHTS INC.

发明人： Christopher Pawlowicz ,  Alexander Sorkin ,  Alexander Krechmer

IPC分类号： G21G5/00 ,  G01R31/303 ,  G01R31/28 ,  G01N23/225 ,  H01L21/66

CPC分类号： G01R31/303 ,  G01N23/2255 ,  G01R31/2896 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

摘要： Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.

摘要翻译： 描述了使用基于聚焦离子束的成像技术在集成电路上跟踪电路的方法和系统的各种实施例。 在一个这样的实施例中，提供了一种用于识别与集成电路上的可切换电力接口相关联的功能组件的方法，其中所述可切换电力接口包括其间具有控制开关的源极和漏极，所述控制开关由控制信号 在集成电路运行期间。 该方法包括用沉积的导电材料连接源极和漏极; 通过源极和漏极中的一个将外部电压施加到可切换电力接口的功率输入; 将集成电路暴露于聚焦离子束; 以及在曝光期间收集集成电路的图像，以确定与可切换电源接口可操作连接的功能组件的高对比度区域。

公开(公告)号：US20130207681A1

公开(公告)日：2013-08-15

申请号：US13754653

申请日：2013-01-30

申请人： Steven Slupsky ,  Christopher Sellathamby

发明人： Steven Slupsky ,  Christopher Sellathamby

IPC分类号： G01R31/303 ,  G01R31/317 ,  G01R1/07

CPC分类号： G01R31/303 ,  G01R1/07 ,  G01R31/3025 ,  G01R31/31724 ,  G01R31/318572 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.