公开(公告)号：US07484883B2

公开(公告)日：2009-02-03

申请号：US11447891

申请日：2006-06-07

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01N25/72 ,  G01N25/20

CPC分类号： G01K11/165 ,  G01K2213/00

摘要： To detect a defect without being limited to the current path of a sample. The presence or absence of a defect in a sample is detected by allowing said sample to stand for a predetermined period of time after heating said sample with a heat source and by observing the temperature distribution formed on said sample by an observation unit.

摘要翻译： 检测缺陷而不限于样品的当前路径。 通过在用热源加热所述样品之后，通过使观察单元观察形成在所述样品上的温度分布，允许所述样品静置预定时间来检测样品中是否存在缺陷。

公开(公告)号：US07173447B2

公开(公告)日：2007-02-06

申请号：US11038485

申请日：2005-01-21

申请人： Masatsugu Yamashita ,  Kodo Kawase ,  Masayoshi Tonouchi ,  Toshihiro Kiwa ,  Kiyoshi Nikawa

发明人： Masatsugu Yamashita ,  Kodo Kawase ,  Masayoshi Tonouchi ,  Toshihiro Kiwa ,  Kiyoshi Nikawa

IPC分类号： G01R31/26

CPC分类号： G01R31/311

摘要： An apparatus for diagnosing a fault in a semiconductor device includes an laser applying unit, a detection/conversion unit, and a fault diagnosis unit. The semiconductor device is held at a state where no bias voltage is applied thereto. The laser applying unit then applies a pulse laser beam having a predetermined wavelength to the semiconductor device so as to two-dimensionally scan the semiconductor device with the pulse laser beam. The detection/conversion unit detects an electromagnetic wave generated from a laser applied position in the semiconductor device, and converts the detected electromagnetic wave into a time-varying voltage signal that corresponds to a time-varying amplitude of an electric field of the electromagnetic wave. The fault diagnosis unit derives an electric field distribution in the semiconductor device on the basis of the time-varying voltage signal to perform fault diagnosis on the semiconductor device.

摘要翻译： 用于诊断半导体器件中的故障的装置包括激光施加单元，检测/转换单元和故障诊断单元。 半导体器件保持在不施加偏置电压的状态。 激光施加单元然后将具有预定波长的脉冲激光束施加到半导体器件，以便用脉冲激光束对半导体器件进行二维扫描。 检测/转换单元检测从半导体器件中的激光施加位置产生的电磁波，并将检测到的电磁波转换成对应于电磁波的电场的时变幅度的时变电压信号。 故障诊断单元根据时变电压信号，在半导体装置中导出电场分布，对半导体装置进行故障诊断。

公开(公告)号：US20090002000A1

公开(公告)日：2009-01-01

申请号：US12164437

申请日：2008-06-30

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01R31/311

CPC分类号： G01R31/311 ,  G01R31/315

摘要： Failure analysis method includes performing fixed radiation of semiconductor chip (wafer) by photocurrent generation laser beam, scanning and radiating a region to be observed on semiconductor chip by heating laser beam, detecting, by a SQUID fluxmeter, current change generated in the semiconductor chip by radiating the photocurrent generation laser beam and the heating laser beam, and analyzing failure of the semiconductor chip based on current change detected by the SQUID fluxmeter. Radiation of photocurrent generation laser beam and heating laser beam are performed from a back surface side of the LSI chip, and detection by the SQUID fluxmeter is performed on a front surface side of the LSI chip. In analysis of failure of the LSI chip, image processing is performed in which a signal outputted from the SQUID fluxmeter is made to correspond to a scanning point. Visualization of defects is possible.

摘要翻译： 故障分析方法包括通过光电流产生激光进行半导体芯片（晶片）的固定辐射，通过加热激光束扫描和照射半导体芯片上要观察的区域，通过SQUID磁通计检测在半导体芯片中产生的电流变化 照射光电流产生激光束和加热激光束，并且基于由SQUID通量计检测到的电流变化来分析半导体芯片的故障。 从LSI芯片的背面进行光电流产生激光束和加热激光的照射，在LSI芯片的正面侧进行SQUID磁通计的检测。 在对LSI芯片的故障进行分析时，执行从SQUID磁通计输出的信号对应于扫描点的图像处理。 缺陷的可视化是可能的。

公开(公告)号：US20060280222A1

公开(公告)日：2006-12-14

申请号：US11447891

申请日：2006-06-07

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01N25/72 ,  G01K3/00 ,  G01K1/16

CPC分类号： G01K11/165 ,  G01K2213/00

摘要： To detect a defect without being limited to the current path of a sample. The presence or absence of a defect in a sample is detected by allowing said sample to stand for a predetermined period of time after heating said sample with a heat source and by observing the temperature distribution formed on said sample by an observation unit.

公开(公告)号：US06610918B2

公开(公告)日：2003-08-26

申请号：US10095858

申请日：2002-03-12

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： H01L3528

CPC分类号： G01R31/311

摘要： A nondestructive inspection device (or method) is basically configured such that a laser beam (1300 nm) is irradiated on a surface (or back) of a semiconductor device chip to scan. Due to irradiation of the laser beam, a defect position is heated to cause a thermoelectromotive current, which induces a magnetic field. A magnetic field detector such as SQUID detects a strength of the magnetic field, based on which a scan magnetic field image is produced. A display device superimposes the scan magnetic field image on a scan laser microphotograph on a screen, so it is possible to perform defect inspection on the semiconductor device chip. Incidentally, a semiconductor device wafer is constructed to include a thermoelectromotive force generator and its wires, which are electrically connected to first-layer wires. By irradiation of the laser beam on the thermoelectromotive force generator, it is possible to detect a short-circuit defect, which lies between the first-layer wires. Further, it is possible to perform nondestructive inspection on a semiconductor integrated circuit, which is in an intermediate stage of manufacture before formation of bonding pads and which includes a closed circuit configured by a first-layer wire, including a thermoelectromotive force generating defect, a circuit via and an inspection via as well as a metal film, which is formed in a relatively broad range of a surface area and is used to form a second-layer wire.

公开(公告)号：US06320396B1

公开(公告)日：2001-11-20

申请号：US08906979

申请日：1997-08-06

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01R31305

CPC分类号： H01L22/12 ,  G01R31/311 ,  H01L2924/0002 ,  H01L2924/00

摘要： Laser beam 104 having an irradiation power not less than 1 mW is irradiated onto an observed region, and a variation in a power source current 112 is detected. When the laser beam 104 is irradiated onto a parasitic insulating film 107 which is a parasitic MIM structural spot, the current 112 increases due to a temperature characteristic of the current 112 flowing through the parasitic insulating film 107, whereby the portion of the parasitic MIM structure can be detected. Moreover, laser beam 108 having a wavelength not less than 1.0 &mgr;m is irradiated onto an observed region from the back surface of the chip, and a variation in the power source current is detected. Light having a wavelength not less than 1.0 &mgr;m has the ability to travel through a Si substrate 110 so that the laser beam reaches a wiring portion. Irradiation of the laser beam onto the parasitic insulating film 107 having the parasitic MIM structure increases the current, so that the portion of the parasitic MIM structure can be detected.

摘要翻译： 具有不小于1mW的照射功率的激光束104被照射到观察区域上，并检测电源电流112的变化。 当激光束104照射到作为寄生MIM结构点的寄生绝缘膜107上时，电流112由于流过寄生绝缘膜107的电流112的温度特性而增加，由此寄生MIM结构的部分 可以检测。 此外，具有不小于1.0μm的波长的激光束108从芯片的背面照射到观察区域上，并检测电源电流的变化。 具有不小于1.0μm的波长的光具有穿过Si衬底110的能力，使得激光束到达布线部分。 将激光束照射到具有寄生MIM结构的寄生绝缘膜107上增加电流，从而可以检测寄生MIM结构的部分。

公开(公告)号：US6028435A

公开(公告)日：2000-02-22

申请号：US821518

申请日：1997-03-21

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01R31/302 ,  G01R31/265 ,  G01R31/311 ,  H01L21/66 ,  G01R31/28

CPC分类号： G01R31/311 ,  G01R31/2656

摘要： In a system for evaluating a semiconductor device, a laser beam generating unit generates a laser beam, and an optical fiber receives the laser beam to heat an area of the semiconductor device. A current deviation detector or a voltage deviation detector is connected to a terminal of the semiconductor device. As a result, the current deviation detector or the voltage deviation detector detects a current deviation or a voltage deviation at the terminal of the semiconductor device.

摘要翻译： 在用于评估半导体器件的系统中，激光束产生单元产生激光束，并且光纤接收激光束以加热半导体器件的区域。 电流偏差检测器或电压偏差检测器连接到半导体器件的端子。 结果，电流偏差检测器或电压偏差检测器检测半导体器件的端子处的电流偏差或电压偏差。

公开(公告)号：US5422498A

公开(公告)日：1995-06-06

申请号：US227241

申请日：1994-04-13

申请人： Kiyoshi Nikawa ,  Yasuko Hanagama ,  Toyokazu Nakamura

发明人： Kiyoshi Nikawa ,  Yasuko Hanagama ,  Toyokazu Nakamura

IPC分类号： G01R31/28 ,  G01R31/311 ,  G01R31/00

CPC分类号： G01R31/311 ,  G01R31/2853

摘要： The invention provides an apparatus for diagnosing a void within a conductive material for interconnections of semiconductor integrated circuits. A laser beam irradiating section is provided for supplying a thermal wave to interconnections of the semiconductor integrated circuits to cause a rise of a temperature of the conductive material due to a thermal accumulation around a void within the conductive material, the thermal wave supplying section being able to move in a plane for accomplishment of a scanning operation of the thermal wave supply. A voltage applying section is connected to the interconnections. A current detecting section is connected to the interconnections for detecting an amount of an electrical current flowing through any part of the interconnections to sense a variation of the amount thereof on account of the rise of the temperature of the conductive material due to the thermal accumulation around the void within the conductive material so as to detect any void within the conductive material.

摘要翻译： 本发明提供一种用于诊断用于半导体集成电路的互连的导电材料内的空隙的装置。 提供激光束照射部分，用于将热波提供给半导体集成电路的互连，导致由导电材料内的空隙周围的热积聚引起的导电材料的温度升高，热波供应部能够 在飞机中移动以完成热波供应的扫描操作。 电压施加部连接到互连。 电流检测部分连接到互连件，用于检测流过互连部分的电流量，以便由于热累积导致的导电材料的温度升高而感测其量的变化 导电材料内的空隙，以便检测导电材料内的任何空隙。

公开(公告)号：US07495449B2

公开(公告)日：2009-02-24

申请号：US11589949

申请日：2006-10-31

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01R31/00 ,  G01R33/02

CPC分类号： G01R31/311

摘要： A non-destructive testing method of improved efficiency. Two one-dimensional images are obtained by scanning an optical line over an object to be tested in an X- and Y-directions each for one scan in lieu of conducting a prior art method of two-dimensionally scanning a optical spot on the object to be tested. A two-dimensional image is reconstructed from the obtained two one-dimensional images. Since only two relative scans between the object to be tested and the optical line is necessary, scanning time is remarkably shortened in comparison with that of the prior art.

摘要翻译： 提高效率的无损检测方法。 通过在用于一次扫描的X和Y方向上的待测试物体上扫描光线以获得二维一维图像，代替对现有技术的二维扫描物体上的光点的方法 被测试。 从获得的两个一维图像重建二维图像。 由于需要测试的对象和光线之间只需要两次相对扫描，所以与现有技术相比，扫描时间显着缩短。

公开(公告)号：US07250758B2

公开(公告)日：2007-07-31

申请号：US11374160

申请日：2006-03-14

申请人： Kiyoshi Nikawa

发明人： Kiyoshi Nikawa

IPC分类号： G01R33/035

CPC分类号： G01N27/82 ,  Y10S505/846

摘要： A non-destructive method of narrowing down the location of a failure in a sample includes a first step of acquiring first and second images of magnetic-field distributions obtained by scanning a laser beam irradiating first and second samples, respectively, and if there is a difference between the first and second images of the magnetic-field distributions, a second step of acquiring first and second current images from magnetic-field distributions acquired by scanning the first and second samples by a magnetic-field detector in a state in which a prescribed location on the first and second samples is being irradiated by the laser beam. The difference between the first and second current images is found and, based upon the difference image found, it becomes possible to identify a disparity in current paths relating to the prescribed location on the first and second samples.

摘要翻译： 缩小样品中故障位置的非破坏性方法包括：第一步骤，分别通过扫描照射第一和第二样品的激光束获得磁场分布的第一和第二图像，如果存在 磁场分布的第一图像和第二图像之间的差异;第二步骤，通过由磁场检测器扫描第一和第二样本所获得的磁场分布获取第一和第二当前图像， 第一和第二样品上的位置被激光束照射。 找到第一和第二当前图像之间的差异，并且基于找到的差分图像，可以识别与第一和第二样本上的规定位置有关的电流路径中的视差。