发明授权
- 专利标题： Method for washing substrates
- 专利标题（中）： 洗涤基材的方法
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申请号： US976262申请日： 1997-11-21
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公开(公告)号： US5817185A公开(公告)日： 1998-10-06
- 发明人: Naoki Shindo , Shigenori Kitahara , Takayuki Toshima , Kenji Yokomizo
- 申请人： Naoki Shindo , Shigenori Kitahara , Takayuki Toshima , Kenji Yokomizo
- 申请人地址： JPX
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX
- 优先权： JPX7-019820 19950112; JPX7-019821 19950112; JPX7-019822 19950112; JPX7-019823 19950112; JPX7-019824 19950112; JPX7-019825 19950112
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/306 ; H01L21/677 ; B08B13/00
摘要：
A method of washing substrates arranged at a substantially equal pitch internal in a cassette which includes steps of (a) transferring the substrates to a holder a pitch interval narrower than the arrangement pitch interval in said cassette; (b) supplying a washing solution into a processing bath; (c) conveying the holder holding the substrates into the processing bath; (d) dipping the substrates in the washing solution in the processing bath to wash the substrates; and (e) supplying a rinse solution into the processing bath to substitute the washing solution with the rinse solution to rinse the substrates in the processing bath.
公开/授权文献
- US5316384A Primary-secondary circuit hydraulic interface 公开/授权日：1994-05-31
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