发明授权
- 专利标题: Device for cutting a wire laid on a substrate
- 专利标题(中): 用于切割放置在基板上的电线的装置
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申请号: US707030申请日: 1996-09-03
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公开(公告)号: US5826473A公开(公告)日: 1998-10-27
- 发明人: Yuuji Saka , Nori Inoue , Takahiro Onizuka , Yoshito Oka , Hideo Matsuoka
- 申请人: Yuuji Saka , Nori Inoue , Takahiro Onizuka , Yoshito Oka , Hideo Matsuoka
- 申请人地址: JPX
- 专利权人: Sumitomo Wiring Systems, Ltd.
- 当前专利权人: Sumitomo Wiring Systems, Ltd.
- 当前专利权人地址: JPX
- 优先权: JPX7-223684 19950831
- 主分类号: B60R16/02
- IPC分类号: B60R16/02 ; H01R9/24 ; H02B3/00 ; H02G1/12 ; H02G3/16 ; B26D7/06
摘要:
A continuous strand of wire is laid in a wire groove or between pairs of guides on a substrate and is cut at desired locations to form individual circuits. At least one recess below the level of the wire laying plane is positioned to correspond to a scrap wire portion to be cut off. The recess is wide enough to allow insertion of cutters. The cutters include pairs of first and second cutting blades located at opposite sides of the wire which are moved toward the wire so that both ends of the scrap wire portion are cut by the first cutting blades and by the second cutting blades, respectively.
公开/授权文献
- US4611444A Sanitary acoustical ceiling 公开/授权日:1986-09-16