发明授权
- 专利标题： Ball grid array package employing solid core solder balls
- 专利标题（中）： 采用实芯焊球的球栅阵列封装
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申请号： US837685申请日： 1997-04-21
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公开(公告)号： US5841198A公开(公告)日： 1998-11-24
- 发明人: Chok J. Chia , Patrick Variot , Maniam Alagaratnam
- 申请人： Chok J. Chia , Patrick Variot , Maniam Alagaratnam
- 申请人地址： CA Milpitas
- 专利权人： LSI Logic Corporation
- 当前专利权人： LSI Logic Corporation
- 当前专利权人地址： CA Milpitas
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H05K3/34 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A ball grid array package utilizes solder balls having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard assembly are heated to the melting point of the solder material, the cores remain solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder from being squashed and flowing to adjacent ball contacts.
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