发明授权
- 专利标题： Film circuit and method of manufacturing the same
- 专利标题（中）： 薄膜电路及其制造方法
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申请号： US794203申请日： 1997-01-31
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公开(公告)号： US5843810A公开(公告)日： 1998-12-01
- 发明人: Kazuhiro Sato , Kenji Osawa
- 申请人： Kazuhiro Sato , Kenji Osawa
- 申请人地址： JPX Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-019733 19960206
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/12 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
公开/授权文献
- USD343963S Chair frame 公开/授权日：1994-02-08
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