摘要:
A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.
摘要:
In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
摘要:
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
摘要:
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
摘要:
In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
摘要:
A method for preparing a Eucalyptus extract which decreases the Eucalyptus-specific odor and obtains the effective ingredient in high purity and high yield as a physiologically-active ingredient. An essential oil constituent is removed from the Eucalyptus plant and the residue is extracted with water or an organic solvent aqueous solution. Next, the obtained extraction residue is further extracted with an organic solvent aqueous solution or an organic solvent, whereby Macrocarpal A, Macrocarpal B, and Macrocarpal C contained in the Eucalyptus as a physiological active substance are prepared in higher content than using conventional methods. Further, the extract has improved good taste, appearance, and other desirable properties.
摘要:
An object of the present invention is to provide a preventive agent for atopic dermatitis and food products containing the agent. The present inventors conducted extensive studies and, as the result, found that atopic dermatitis can be prevented by orally ingesting collagen. The present invention provides a preventive agent for atopic dermatitis comprising collagen and food products containing the preventive agent for atopic dermatitis.
摘要:
To provide a composition for treatment and/or prevention of skin disorder, intensive research has been conducted. As a result, a mangosteen (Garcinia mangostana L.) pericarp extract has been found to have a reducing effect on the skin disorder. The present invention provides a composition for treatment and/or prevention of skin disorder, the composition including a mangosteen pericarp extract.
摘要:
To provide a prophylactic and/or therapeutic agent for atopic dermatitis with minimal concerns of adverse drug reactions and high safety, various researches were conducted. As a result, it was found that an extract extracted from a mangosteen (Garcinia mangostana L.) peel with a polar solvent prevented or healed atopic dermatitis. That is, the present invention provides a prophylactic and/or therapeutic agent for atopic dermatitis comprising an extract extracted from a mangosteen peel with a polar solvent. Furthermore, the present invention provides a food containing the above-mentioned prophylactic and/or therapeutic agent for atopic dermatitis.
摘要:
To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.