Invention Grant
- Patent Title: Buried strap formation in a DRAM trench capacitor
- Patent Title (中): 在DRAM沟槽电容器中形成埋地带
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Application No.: US879871Application Date: 1997-06-20
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Publication No.: US5844266APublication Date: 1998-12-01
- Inventor: Reinhard Stengl , Erwin Hammerl , Herbert L. Ho , Jack A. Mandelman , Radhika Srinivasan , Alvin P. Short
- Applicant: Reinhard Stengl , Erwin Hammerl , Herbert L. Ho , Jack A. Mandelman , Radhika Srinivasan , Alvin P. Short
- Applicant Address: DEX Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DEX Munich
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L21/822 ; H01L21/8242 ; H01L27/04 ; H01L27/108
Abstract:
In a method for making an electrical connection between a trench storage capacitor and an access transistor in a DRAM cell, the electrical connection is formed through the selectively controlled outdiffusion of either N-type or P-type dopants present in the trench through a single crystalline semiconducting material which is grown by epitaxy (epi) from the trench sidewall. This epitaxially grown single crystalline layer acts as a barrier to excessive dopant outdiffusion which can occur in the processing of conventional DRAMs.
Public/Granted literature
- USD301192S Snack tray or the like Public/Granted day:1989-05-23
Information query
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