发明授权
US5844309A Adhesive composition, semiconductor device using the composition and
method for producing a semiconductor device using the composition
失效
粘合剂组合物，使用该组合物的半导体器件和使用该组合物制造半导体器件的方法
- 专利标题： Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
- 专利标题（中）： 粘合剂组合物，使用该组合物的半导体器件和使用该组合物制造半导体器件的方法
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申请号： US754061申请日： 1996-12-03
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公开(公告)号： US5844309A公开(公告)日： 1998-12-01
- 发明人: Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
- 申请人： Yukio Takigawa , Shigeaki Yagi , Toshimi Kawahara , Mitsunada Osawa , Hiroyuki Ishiguro , Shinya Nakaseko , Takashi Hozumi , Masaaki Seki
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX7-060518 19950320; JPX7-285348 19951101
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L23/10 ; H01L23/053
摘要：
An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.
公开/授权文献
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