公开(公告)号：US20090272765A1

公开(公告)日：2009-11-05

申请号：US12094510

申请日：2006-06-08

申请人： Masaaki Seki ,  Masato Suzuki

发明人： Masaaki Seki ,  Masato Suzuki

IPC分类号： B65D88/54 ,  B67D5/40 ,  B65D83/00

CPC分类号： B05B11/3053 ,  B65D83/16 ,  B65D83/207 ,  B65D83/752

摘要： The tip-stop mechanism for an aerosol container has a needle valve placed into a passage area and closes discharge hole due to plate springs engagement with tapered surfaces of the needle valve. An operation lever is supported on a pivot shaft and when pressed downward forces a portion of the lever to cause the needle valve to move backward, opening the discharge hole. After that, the operation lever engages the upper surface of the spout and moves downward together with the spout and the stem, thereby the lever is shifted to an operation mode.

摘要翻译： 用于气溶胶容器的尖端停止机构具有置于通道区域中的针阀，并且由于与针阀的锥形表面的板簧接合而封闭排出孔。 操作杆支撑在枢轴上，并且当向下推动时，力部分杆使针阀向后移动，打开排出孔。 此后，操作杆与喷口的上表面接合，并与喷嘴和阀杆一起向下运动，从而将杠杆转移到操作模式。

公开(公告)号：US06476503B1

公开(公告)日：2002-11-05

申请号：US09606196

申请日：2000-06-29

申请人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

发明人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/12105 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147

摘要： A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.

摘要翻译： 一种半导体器件，包括用封装树脂密封的半导体芯片。 柱状电极连接到半导体芯片的电极焊盘，并且延伸穿过封装树脂。 柱状电极由接合线制成，并且包括扩大的外端。 焊球布置在封装树脂的表面上并连接到柱状电极的外端。 在另一个例子中，通过半切割接合线，接合每个接合线的一端，以及在半切部分切割接合线来形成引线。

公开(公告)号：US6022759A

公开(公告)日：2000-02-08

申请号：US25327

申请日：1998-02-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US5844309A

公开(公告)日：1998-12-01

申请号：US754061

申请日：1996-12-03

申请人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

发明人： Yukio Takigawa ,  Shigeaki Yagi ,  Toshimi Kawahara ,  Mitsunada Osawa ,  Hiroyuki Ishiguro ,  Shinya Nakaseko ,  Takashi Hozumi ,  Masaaki Seki

IPC分类号： H01L21/58 ,  H01L23/10 ,  H01L23/053

CPC分类号： H01L24/83 ,  H01L23/10 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351

摘要： An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

摘要翻译： 一种粘合剂组合物，其包括：主要成分，其包含树脂材料，用于溶解所述主要成分的溶剂和添加到所述主要成分中的填料，其中所述填料具有使得其表面的凹凸深度 所述粘合剂组合物在所述粘合剂组合物施加到被粘物上之后等于或小于15μm，并干燥以在热压缩过程之前蒸发所述溶剂。 本发明还公开了一种使用粘合剂组合物的半导体器件，使用粘合剂组合物的粘合方法和使用该粘合剂组合物的半导体器件的制造方法。

公开(公告)号：US5747874A

公开(公告)日：1998-05-05

申请号：US529784

申请日：1995-09-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：USD710200S1

公开(公告)日：2014-08-05

申请号：US29445546

申请日：2013-02-13

申请人： Osamu Takizawa ,  Masaaki Seki ,  Masato Suzuki

设计人： Osamu Takizawa ,  Masaaki Seki ,  Masato Suzuki

公开(公告)号：US06462424B1

公开(公告)日：2002-10-08

申请号：US09705735

申请日：2000-11-06

申请人： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

发明人： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

IPC分类号： H01L2348

CPC分类号： H01L23/49551 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

摘要翻译： 一种制造半导体器件的方法包括：器件本体产生步骤，电耦合引线和半导体芯片，并且通过用树脂封装封装半导体芯片来制造器件本体，使得引线的一部分从树脂封装件露出， 珩磨步骤，至少使用抛光溶液进行珩磨处理，所述抛光溶液至少相对于粘附在从树脂封装暴露的引线部分上的树脂闪光，蚀刻步骤，通过执行形成在引线上形成的不想要的堆叠层结构 在珩磨步骤之后的蚀刻工艺和镀层步骤，在蚀刻步骤之后对引线进行电镀处理以形成由软接合材料制成的镀层。 除了树脂闪光之外，珩磨步骤除去一部分不想要的堆叠层结构。

公开(公告)号：US06433418B1

公开(公告)日：2002-08-13

申请号：US09301345

申请日：1999-04-29

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

IPC分类号： H01L2302

CPC分类号： H01L23/49555 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

摘要翻译： 半导体器件包括其中半导体芯片被密封的树脂封装，所述树脂封装具有第一表面和与第一表面相对的第二表面; 多个引线，其具有连接到所述半导体芯片的内部引线部分和在所述树脂封装体外部延伸的外部引线部分，所述外部引线部分沿着所述树脂封装件的形状弯曲，以在所述第二表面上形成第一端子部分， 第一表面上的零件; 连接装置电连接半导体芯片和引线; 以及设置在引线上或树脂封装上的定位机构，其通过将外引线部分的一部分接合到树脂封装来定位外引线部分。 此外，切断引线和/或连接装置中的至少一个，以便使半导体芯片和引线和/或连接元件中的一个电气断开。

公开(公告)号：US06333564B1

公开(公告)日：2001-12-25

申请号：US09336747

申请日：1999-06-21

申请人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

发明人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

摘要翻译： 一种半导体器件及其制造方法，该器件包括半导体芯片; 作为外部连接端子的球; 电连接半导体芯片和滚珠的基板; 模制树脂，其密封半导体芯片的至少一部分; 以及密封基板和半导体芯片之间的连接部分的连接部密封树脂。 半导体器件通过球安装到印刷电路板上。 模制树脂的热膨胀系数与印刷电路板的热膨胀系数相匹配。 在模制树脂中形成用于保持半导体芯片的侧表面的侧表面保持部分，以限制半导体芯片的热变形。

公开(公告)号：US6165819A

公开(公告)日：2000-12-26

申请号：US206151

申请日：1998-12-07

申请人： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

发明人： Masaaki Seki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Toshio Hamano

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L23/49551 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.