发明授权
- 专利标题: Thermoplastic resin composition
- 专利标题(中): 热塑性树脂组合物
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申请号: US636220申请日: 1996-04-23
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公开(公告)号: US5852100A公开(公告)日: 1998-12-22
- 发明人: Hajime Sadatoshi , Haruyuki Suzuki , Yuichi Miyake , Takao Nomura , Takeyoshi Nishio
- 申请人: Hajime Sadatoshi , Haruyuki Suzuki , Yuichi Miyake , Takao Nomura , Takeyoshi Nishio
- 申请人地址: JPX Osaka JPX Toyota
- 专利权人: Sumitomo Chemical Company, Limited,Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: Sumitomo Chemical Company, Limited,Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka JPX Toyota
- 优先权: JPX7-106762 19950428; JPX7-106763 19950428; JPX7-106764 19950428; JPX7-106765 19950428; JPX7-106766 19950428
- 主分类号: C08K3/00
- IPC分类号: C08K3/00 ; C08L23/08 ; C08L23/10 ; C08L23/12 ; C08L23/16 ; C08L53/00
摘要:
A thermoplastic resin composition with improved low-temperature impact strength and rigidity against heat, comprising (I) 10-40% by weight of a mixture of (a) 10-50% by weight of a propylene homopolymer and/or an ethylene-propylene block copolymer (an isotactic pentad fraction of a propylene homopolymer portion being 0.98 or above) and (b) 50-90% by weight of an olefin-based copolymer rubber, said mixture having been dynamically heat treated in the presence of an organic peroxide and a crosslinking agent, (II) 20-85% by weight of a propylene homopolymer and/or an ethylene-propylene block copolymer (an isotactic pentad fraction of a propylene homopolymer portion being 0.98 or above and a melt index of the propylene homopolymer portion being 30-150 g/10 min), and (III) 5-40% by weight of an inorganic filler.
公开/授权文献
- US4555778A Semiconductor memory device 公开/授权日:1985-11-26
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