发明授权
US5876819A Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same 失效
晶体取向可检测半导体衬底及其制造和使用方法

Crystal orientation detectable semiconductor substrate, and methods of
manufacturing and using the same
摘要:
A semiconductor substrate with no reduction in the effective usage area and mechanical strength, and non-uniformity of the resist film thickness, and method of manufacturing and using the same are obtained. A detection mark for detecting the crystal orientation of a silicon wafer having an outer perimeter entirely of a circular contour is formed at a predetermined region of the silicon wafer. The crystal orientation of the semiconductor wafer can easily be detected with the outer perimeter still taking a circular contour. Therefore, various problems encountered in a conventional semiconductor substrate having an orientation flat or notch such as reduction in mechanical strength and effective usage area, and non-uniformity of the resist film can be circumvented.
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